IP Library Granted Patent US 9,847,123
Granted Patent B2
US 9,847,123 · App. 15/423,646 · Granted Dec 19, 2017

Multi-bit ferroelectric memory device and methods of forming the same

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Quick Facts
Patent No.
US 9,847,123
App. No.
15/423,646
Granted
Dec 19, 2017
Kind
B2
Abstract

Multi-bit ferroelectric memory devices and methods of forming the same are provided. One example method of forming a multi-bit ferroelectric memory device can include forming a first ferroelectric material on a first side of a via, removing a material to expose a second side of the via, and forming second ferroelectric material on the second side of the via at a different thickness compared to the first side of the via.

Claims (28)

1. A memory device, comprising:

an array of multi-bit ferroelectric memory cells comprising a first ferroelectric material formed on an interior side of a via and a second ferroelectric material formed on an exterior side of the via, wherein the first and the second ferroelectric materials have different coercive fields; and

circuitry coupled to the array and configured to program the cells from an initial state to one of a plurality of different states by applying a bias to the cell to change the electric polarizations of at least one of the first ferroelectric material and the second ferroelectric material.

2. The device of claim 1 , wherein the first and the second ferroelectric materials comprise different ferroelectric materials.

3. The device of claim 1 , wherein the first and the second ferroelectric materials have different thicknesses.

4. The device of claim 1 , wherein the plurality of different states comprises at least three states.

5. The device of claim 1 , wherein the initial state and the plurality of different states each comprise a different respective polarization combination corresponding to the first and the second ferroelectric materials, and wherein the circuitry is configured to program the cells from the initial state to a first of the plurality of different states by providing a first bias to the cells sufficient to switch a polarization direction of only the first ferroelectric material.

6. The device of claim 5 , wherein the circuitry is configured to program the cells from the first of the plurality of different states to a second of the plurality of different states by providing a second bias to the cells sufficient to switch a polarization direction of both of the first and the second ferroelectric materials.

7. The device of claim 6 , wherein a direction in which the first bias is applied is opposite to a direction in which the second bias is applied.

8. The device of claim 6 , wherein the circuitry is configured to program the cells from the second of the plurality of different states to a third of the plurality of different states by providing a third bias to the cells sufficient to switch a polarization direction of only the first ferroelectric materials.

9. The device of claim 6 , wherein a thickness of the first ferroelectric material is less than a thickness of the second ferroelectric material.

10. A memory device, comprising:

an array of multi-bit ferroelectric memory cells comprising a first ferroelectric material formed on an interior side of a via and a second ferroelectric material formed on an exterior side of the via, wherein the first and the second ferroelectric materials have different coercive fields; and

sensing circuitry coupled to the array and configured to sense a state to which a cell is programmed responsive to an applied voltage difference between a selected sense line and a selected access line of the array;

wherein the sensed state of the cell depends on a particular electric polarization combination corresponding to the first and the second ferroelectric materials.

11. The device of claim 10 , wherein the first and the second ferroelectric materials comprise different ferroelectric materials.

12. The device of claim 10 , wherein the first and the second ferroelectric materials have different thicknesses.

13. The device of claim 10 , wherein the cell is programmable to at least four different electric polarization combinations.

14. The device of claim 10 , wherein a dielectric material separates the first ferroelectric material and the second ferroelectric material.

15. A method of sensing data, comprising:

biasing a multi-bit ferroelectric memory cell by applying a voltage difference between a selected sense line and a selected access line; and

determining a particular state of the memory cell responsive to the applied voltage difference;

wherein the multi-bit ferroelectric memory cell comprises a first ferroelectric material formed on an interior side of a via and a second ferroelectric material formed on an exterior side of the via, wherein the first and the second ferroelectric materials have different coercive fields, and wherein the particular state of the memory cell depends on an electric polarization combination corresponding to the first material and the second material.

16. The method of claim 15 , wherein the memory cell comprises at least four electric polarization combinations, and wherein determining the particular state includes measuring a bias on the selected sense line responsive to the applied voltage difference.

17. The method of claim 15 , wherein the method includes determining the particular state by using a sense amplifier coupled to the selected sense line.

18. The method of claim 15 , wherein the first and the second ferroelectric materials have different thicknesses.

19. The method of claim 15 , wherein the first and second ferroelectric materials are different materials.

20. The method of claim 15 , wherein the method includes biasing the multi-bit ferroelectric memory cell by using a half select biasing scheme.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050702/0451 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 4 TO PATENT SECURITY AGREEMENT Recorded May 4, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042405/0909 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2017
From: KARDA, KAMAL M.; GEALY, F. DANIEL; RAMASWAMY, D.V. NIRMAL; MOULI, CHANDRA V.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041163/0957 →