Nonvolatile semiconductor memory device and method for manufacturing same
A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of insulating films alternately stacked with a plurality of electrode films in a first direction; a selection gate electrode stacked on the stacked structural unit in the first direction; an insulating layer stacked on the selection gate electrode in the first direction; a first semiconductor pillar piercing the stacked structural unit, the selection gate electrode, and the insulating layer in the first direction, a first cross section of the first semiconductor pillar having an annular configuration, the first cross section being cut in a plane orthogonal to the first direction; a first core unit buried in an inner side of the first semiconductor pillar, the first core unit being recessed from an upper face of the insulating layer; and a first conducting layer of the first semiconductor pillar provided on the first core unit to contact the first core unit.
1. A nonvolatile semiconductor memory device, comprising:
a stacked structural unit including a plurality of electrode films stacked in a first direction;
a first selection gate electrode stacked above the stacked structural unit in the first direction;
a first pillar including a first semiconductor pillar, a first insulating layer, and a second insulating layer, at least a part of the first pillar extending in the stacked structural unit and the first selection gate electrode in the first direction, the second insulating layer being located between the first insulating layer and the first selection gate electrode, the first semiconductor pillar being located between the first insulating layer and the second insulating layer;
a conductive layer provided on the first semiconductor pillar and the first insulating layer;
a bit line extending in a second direction, the second direction crossing the first direction; and
a contact plug provided between the conductive layer and the bit line and electrically connected with the conductive layer and the bit line, a width of the contact plug in the second direction being larger than a width of the conductive layer in the second direction.
2. The device according to claim 1 , wherein the width of the contact plug is larger than a width of the first pillar in the second direction.
3. The device according to claim 1 , wherein the conductive layer includes a semiconductor layer containing a impurity.
4. The device according to claim 3 , wherein the impurity includes phosphorous.
5. The device according to claim 1 , wherein the conductive layer includes polysilicon containing a impurity.
6. The device according to claim 1 , wherein an upper end of the first insulating layer in the first direction is located above a position of an upper end of the first selection gate electrode in the first direction.
7. The device according to claim 1 , wherein: the second insulating layer is further located between the first insulating layer and the electrode films, at least a part of the second insulating layer includes:
a charge storage layer provided between the first semiconductor pillar and the electrode films;
a first memory unit insulating film provided between the electrode films and the charge storage layer; and
a second memory unit insulating film provided between the first semiconductor pillar and the charge storage layer.