Array substrate and method of mounting integrated circuit using the same
An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.
1. An electronic device comprising:
an array substrate;
a pad portion disposed on the array substrate; and
an integrated circuit disposed on the pad portion and comprising a bump portion;
wherein:
the pad portion comprises a first sub-pad unit comprising a first pad having a parallelogram shape and a second sub-pad unit comprising a second pad having a parallelogram shape, and the first pad and the second pad are symmetrically arranged with respect to a first imaginary line that divides the pad portion; and
the pad portion is electrically connected to the bump portion.
2. The electronic device of claim 1 , wherein the bump portion comprises a first sub-bump unit comprising a first bump having a parallelogram shape and a second sub-bump unit comprising a second bump having a parallelogram shape.
3. The electronic device of claim 2 , wherein the first bump and the second bump are symmetrically arranged with respect to a second imaginary line that divides the bump portion.
4. The electronic device of claim 2 , wherein a shape of the first bump corresponds to a shape of the first pad, and a shape of the second bump corresponds to a shape of the second pad.
5. The electronic device of claim 2 , wherein the first pad is electrically connected to the first bump and the second pad is electrically connected to the second bump.
6. The electronic device of claim 2 , wherein an area of the first pad is larger than an area of the first bump.
7. The electronic device of claim 2 , wherein the pad portion further comprises a third sub-pad unit comprising a third pad having a rectangular shape and disposed between the first sub-pad unit and the second sub-pad unit.
8. The electronic device of claim 7 , wherein the bump portion further comprises a third sub-bump unit comprising a third bump having a rectangular shape and disposed between the first sub-bump unit and the second sub-bump unit.
9. The electronic device of claim 2 , wherein:
the first bump comprises a first region and a second region; and
the first region overlaps the first pad and the second region does not overlap the first pad.
10. The electronic device of claim 2 , wherein the first bump completely overlaps the first pad.
11. An electronic device comprising:
an array substrate;
a pad portion disposed on the array substrate; and
an integrated circuit disposed on the pad portion and comprising a bump portion;
wherein:
the pad portion comprises a first sub-pad unit comprising first pads each having a parallelogram shape; and
the bump portion comprises a first sub-bump unit comprising first bumps each having a parallelogram shape, and a second sub-bump unit comprising second bumps each having a parallelogram shape.
12. The electronic device of claim 11 , wherein:
the pad portion further comprises a second sub-pad unit comprising second pads each having a parallelogram shape; and
the first pads and the second pads are symmetrically arranged with respect to a first imaginary line that divides the pad portion.
13. The electronic device of claim 12 , wherein:
the bump portion further comprises a second sub-bump unit comprising second bumps each having a parallelogram shape; and
the first bumps and the second bumps are symmetrically arranged with respect to a second imaginary line that divides the pad portion.
14. The electronic device of claim 12 , wherein:
each of the first pads have an inclination angle defined as an acute internal angle between the short sides and the long sides of each of the first pads; and
inclination angles of the first pads increase as the first pads get closer to the first imaginary line.
15. The electronic device of claim 12 , wherein:
each of the second pads have an inclination angle defined as an acute internal angle between the short sides and the long sides of each of the second pads; and
inclination angles of the second pads increase as the second pads get closer to the first imaginary line.
16. The electronic device of claim 12 , wherein the pad portion further comprises a third sub-pad unit comprising a third pad having a rectangular shape and disposed between the first sub-pad unit and the second sub-pad unit.