IP Library Granted Patent US 10,056,901
Granted Patent B2
US 10,056,901 · App. 15/429,973 · Granted Aug 21, 2018

Impedance control in radio-frequency switches

Inventors: Ambarish Roy (Waltham, MA); Guillaume Alexandre Blin (Carlisle, MA)
Assignee: Skyworks Solutions, Inc.
H03K19/0005H03K17/693H03K2217/0036
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Quick Facts
Patent No.
US 10,056,901
App. No.
15/429,973
Granted
Aug 21, 2018
Kind
B2
Abstract

A radio-frequency switch includes a first field-effect transistor disposed between a first node and a second node, the first field-effect transistor having a source, a drain, a gate, and a body. The switch further includes a coupling path connected between the body of the first field-effect transistor and the gate of the first field-effect transistor, the coupling path including a diode. The switch further includes an adjustable impedance network connected between the body of the first field-effect transistor and a ground reference, the adjustable impedance network being configured to reduce radio-frequency distortion in the first field-effect transistor.

Claims (24)

1. A radio-frequency switch comprising:

a first field-effect transistor disposed between a first node and a second node, the first field-effect transistor having a source, a drain, a gate, and a body;

a coupling path connected between the body of the first field-effect transistor and the gate of the first field-effect transistor, the coupling path including a diode; and

an adjustable impedance network connected between the body of the first field-effect transistor and a ground reference, the adjustable impedance network being configured to reduce radio-frequency distortion in the first field-effect transistor.

2. The radio-frequency switch of claim 1 wherein the adjustable impedance network is configured to present a first impedance when the first field-effect transistor is transmitting a signal having a first frequency and present a second impedance when the first field-effect transistor is transmitting a signal having a second frequency higher than the first frequency.

3. The radio-frequency switch of claim 1 wherein the first field-effect transistor is a silicon-on-insulator field-effect transistor.

4. The radio-frequency switch of claim 1 wherein the adjustable impedance network includes a second field-effect transistor having a gate, a drain, and a source.

5. The radio-frequency switch of claim 4 wherein the second field-effect transistor is connected at one of the drain or source of the second field-effect transistor to the body of the first field-effect transistor and connected at the other of the drain or the source of the second field-effect transistor to the ground reference.

6. The radio-frequency switch of claim 4 wherein the second field-effect transistor is operable to provide a desired impedance for reducing undesired radio-frequency distortion in the first field-effect transistor at a frequency of operation.

7. The radio-frequency switch of claim 4 wherein the adjustable impedance network includes one or more resistors connected in series with the second field-effect transistor.

8. The radio-frequency switch of claim 4 wherein the adjustable impedance network includes one or more capacitors connected in series with the second field-effect transistor.

9. The radio-frequency switch of claim 1 wherein the adjustable impedance network includes a capacitor.

10. The radio-frequency switch of claim 9 wherein the capacitor is connected at a first end to the body of the first field-effect transistor and at a second end to the ground reference.

11. The radio-frequency switch of claim 1 wherein the adjustable impedance network includes a capacitor connected in series with an inductor.

12. The radio-frequency switch of claim 1 wherein the adjustable impedance network includes a plurality of capacitors configured to be selectively coupled to the body of the first field-effect transistor using a network of switches.

13. A radio-frequency switch module comprising:

a packaging substrate configured to receive a plurality of components;

a semiconductor die mounted on the packaging substrate, the semiconductor die including a first field-effect transistor having a gate, a drain, a source, and a body;

a coupling path connected between the body of the first field-effect transistor and one of the source, the drain, and the gate of the first field-effect transistor, the coupling path including a diode; and

an impedance control circuit connected between the body of the first field-effect transistor and a ground reference, the impedance control circuit being configured to reduce radio-frequency distortion in the first field-effect transistor.

14. The radio-frequency switch module of claim 13 wherein the impedance control circuit includes a second field-effect transistor having a gate, a drain, and a source.

15. The radio-frequency switch module of claim 14 wherein the second field-effect transistor is connected at one of the drain or source of the second field-effect transistor to the body of the first field-effect transistor.

16. The radio-frequency switch module of claim 13 wherein the impedance control circuit includes a capacitor connected to the body of the first field effect transistor.

17. The radio-frequency switch module of claim 13 wherein the impedance control circuit includes a capacitor connected in series with an inductor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2017
From: ROY, AMBARISH; BLIN, GUILLAUME ALEXANDRE
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 043283/0435 →
Continuity (2)
Provisional Application 62294245 · Feb 11, 2016
Related Publication 20170237432A1 · Aug 17, 2017
Cited By (7)
US 12,316,286 US 12,334,885 US 12,525,492 US 12,593,511 US 12,598,812 US 12,604,709 US 12,721,112