Method to improve adhesion of photoresist on silicon substrate for extreme ultraviolet and electron beam lithography
View Patent ↗An etch process that includes removing an oxide containing surface layer from a semiconductor surface to be etched by applying a hydrofluoric (HF) based chemistry, wherein the hydrofluoric (HF) based chemistry terminates the semiconductor surface to be etched with silicon-hydrogen bonds, and applying a vapor priming agent bearing chemical functionality based on the group consisting of alkynes, alcohols and a combination thereof to convert the silane terminated surface to a hydrophobic organic surface. The method continues with forming a photoresist layer on the hydrophobic organic surface; and patterning the photoresist layer. Thereafter, the patterned portions of the photoresist are developed to provide an etch mask. The portions of the semiconductor surface exposed by the etch mask are then etched.
1. A patterning method comprising:
providing a semiconductor surface to be patterned;
removing an oxide containing surface layer from the semiconductor surface that is to be patterned with a hydrofluoric (HF) based chemistry, wherein applying the HF based chemistry to the surface to be patterned forms a silane terminated surface;
applying a vapor priming agent bearing chemical functionality based on alkynes to convert the silane terminated surface to a hydrophobic organic surface;
forming a photoresist layer on the hydrophobic organic surface;
patterning the photoresist layer; and
developing patterned portions of the photoresist.
2. The method of claim 1 , wherein said patterning is a lithography method selected from the group consisting of EUV lithography, E-beam lithography and combinations thereof.
3. The method of claim 1 , wherein the semiconductor surface is comprised of a type IV semiconductor material.
4. The method of claim 1 , wherein the semiconductor surface comprises amorphous silicon.
5. The method of claim 1 , wherein the hydrofluoric (HF) based chemistry is dilute hydrofluoric acid.
6. The method of claim 1 , wherein said vapor priming agent bearing chemical functionality based on alkynes to convert the silane terminated surface to a hydrophobic organic surface comprises an alkyne selected from the group consisting of 5-chloro-1-pentyne, Propargyl ether, Iodo-1-pentyne, 5-Hexynoic acid, 1,7-Octadiyne, Ethyl propiolate, Dimethyl propargylmalonate, Methyl propiolate, 1-Hexyne, 1-Octyne, and combinations thereof.
7. The method of claim 1 , wherein the forming the photoresist layer comprises spin on deposition.
8. The method of claim 1 , wherein the developing patterned portions of the photoresist comprises TMAH.
9. A patterning method comprising:
providing a semiconductor surface to be patterned;
removing an oxide containing surface layer from the semiconductor surface that is to be patterned with a hydrofluoric (HF) based chemistry, wherein applying the HF based chemistry to the surface to be patterned forms a silane terminated surface;
applying a vapor priming agent bearing chemical functionality based on alcohols to convert the silane terminated surface to a hydrophobic organic surface;
forming a photoresist layer on the hydrophobic organic surface;
patterning the photoresist layer; and
developing patterned portions of the photoresist layer.
10. The method of claim 9 , wherein said patterning is a lithography method selected from the group consisting of EUV lithography, E-beam lithography and combinations thereof.
11. The method of claim 9 , wherein the semiconductor surface is comprised of a type IV semiconductor material.
12. The method of claim 9 , wherein the hydrofluoric (HF) based chemistry is dilute hydrofluoric acid.
13. The method of claim 9 , wherein said vapor priming agent bearing chemical functionality based on alkynes to convert the silane terminated surface to a hydrophobic organic surface comprises an alcohol selected from the group consisting of 2-Propyn-1-ol, 3-Butyn-1-ol, 4-Pentyn-1-ol, 1-Hexyn-3-ol, 4-Pentyn-2-ol, 1-Pentyn-3-ol, 4-Methyl-1-heptyn-3-ol, 5-Hexyn-3-ol, 1-Octyn-3-ol, 3-Butyn-2-ol, 3,5-Dimethyl-1-hexyn-3-ol, 2-Methyl-3-butyn-2-ol, 3-Methyl-1-pentyn-3-ol, 3-Ethyl-1-pentyn-3-ol, 1-Ethynylcyclopentanol and combinations thereof.
14. The method of claim 9 , wherein the forming the photoresist layer comprises spin on deposition.
15. The method of claim 1 , wherein the developing patterned portions of the photoresist comprises TMAH.