Plasma processing method
The present invention provides a plasma processing method for subjecting a sample on which a metal element-containing film is disposed to plasma etching in a processing chamber. The method comprises: subjecting an inside of the processing chamber to plasma cleaning using a boron element-containing gas; removing the boron element using plasma after the plasma cleaning; subjecting the inside of the processing chamber to plasma cleaning using a fluorine element-containing gas after removing the boron element; depositing a deposited film in the processing chamber by plasma using a silicon element-containing gas after the plasma cleaning using the fluorine element-containing gas; and subjecting the sample to plasma etching after depositing the deposited film.
1. A plasma processing method for subjecting a sample on which a metal element-containing film is disposed to plasma etching in a processing chamber, the method comprising:
a first step of subjecting an inside of the processing chamber to plasma cleaning using a boron element-containing gas;
a second step of subjecting the inside of the processing chamber to plasma cleaning using a chlorine gas after the first step;
a third step of subjecting the inside of the processing chamber to plasma cleaning using a fluorine element-containing gas after the second step;
a fourth step of depositing a chamber wall-deposited film in the processing chamber by plasma using a silicon element-containing gas after the third step; and
a fifth step of subjecting the sample to plasma etching after the fourth step,
wherein the first step, the second step, and the third step are sequentially carried out after the first step to the fifth step are sequentially repeated for each of a number of samples of a lot until all samples of the lot are subjected to plasma etching, and
wherein the third step and the fourth step are also performed at the start of processing of each of a plurality of lots, each said lot being detected by a controller configured to recognize an end of lot processing has occurred when a sample is housed at an original position of a sample storage container, before the inside of the processing chamber is subjected to etching of any sample of each said lot, so that an etching rate does not decrease as the number of samples of each said lot is processed.
2. The plasma processing method according to claim 1 , wherein
the boron element-containing gas is a boron trichloride gas,
the fluorine element-containing gas is a nitrogen trifluoride gas, and
the silicon element-containing gas is a silicon tetrachloride gas.
3. The plasma processing method according to claim 2 , wherein the first step further uses a chlorine gas.
4. The plasma processing method according to claim 1 , wherein the boron element-containing gas is a boron trichloride gas.
5. The plasma processing method according to claim 1 , wherein
the plasma in the fourth step is generated by using a silicon tetrachloride gas and an oxygen gas.
6. The plasma processing method according to claim 5 , wherein
the plasma in the third step is generated by using a nitrogen trifluoride gas and an argon gas.
7. The plasma processing method according to claim 6 , wherein
the plasma in the first step is generated by using a boron trichloride gas and a chlorine gas.
8. The plasma processing method according to claim 1 , wherein
the plasma in the fourth step is generated by using a silicon tetrachloride gas, an oxygen gas and an argon gas.
9. The plasma processing method according to claim 8 , wherein
the plasma in the third step is generated by using a nitrogen trifluoride gas and an argon gas.
10. The plasma processing method according to claim 8 , wherein
the plasma in the first step is generated by using a boron trichloride gas and a chlorine gas.