METHODS FOR POLYMER COEFFICIENT OF THERMAL EXPANSION (CTE) TUNING BY MICROWAVE CURING
Methods of curing polyimide to tune the coefficient of thermal expansion are provided herein. In some embodiments, a method of curing a polymer layer on a substrate, includes: (a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature; and (b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature to cure the polymer layer.
1 . A method of curing a polymer layer on a substrate, comprising:
(a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature; and
(b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature to cure the polymer layer.
2 . The method of claim 1 , wherein the polymer layer is polyimide.
3 . The method of claim 1 , wherein the first temperature is about 170 to about 200 degrees Celsius.
4 . The method of claim 3 , wherein the polymer layer and the substrate are heated from about 25 degrees Celsius to the first temperature at a first rate of about 0.01 degrees Celsius to about 4 degrees Celsius per second.
5 . The method of claim 1 , wherein the polymer layer is maintained at the first temperature for a first period of time of about 10 minutes to about 60 minutes.
6 . The method of claim 1 , wherein the variable frequency microwave energy is provided at microwave frequencies ranging from about 5.85 GHz to about 6.65 GHz.
7 . The method of claim 6 , wherein the variable frequency microwave energy is provided at a sweep rate of about 0.25 microseconds per frequency.
8 . The method of claim 1 , wherein the second temperature is about 300 to about 400 degrees Celsius.
9 . The method of claim 8 , wherein the polymer layer and the substrate are heated from the first temperature to the second temperature at a second rate of about 0.01 degrees Celsius per second to about 4 degrees Celsius per second.
10 . The method of claim 1 , wherein the polymer layer is maintained at the second temperature for a second period of time of about 5 to about 60 minutes.
11 . The method of claim 1 , further comprising adjusting the variable frequency microwave energy to decrease the temperature of the polymer layer and the substrate to a third temperature less than the second temperature.
12 . The method of claim 11 , wherein the third temperature is about 250 to about 350 degrees Celsius.
13 . The method of claim 11 , wherein the temperature of the polymer layer and the substrate is decreased from the second temperature to the third temperature at a third rate of about 0.01 degrees Celsius per second to about 4 degrees Celsius per second.
14 . The method of claim 11 , wherein the polymer layer is maintained at the third temperature for a third period of time of about 30 minutes.
15 . The method of claim 1 , wherein (a)-(b) are performed within a microwave processing chamber under vacuum.
16 . A method of curing a polymer layer on a substrate, comprising:
(a) applying a variable frequency microwave energy to the substrate to heat the polymer layer and the substrate to a first temperature of about 170 to about 200 degrees Celsius for a first period of time; and
(b) adjusting the variable frequency microwave energy to increase a temperature of the polymer layer and the substrate to a second temperature of about 300 to about 400 degrees Celsius for a second period of time to cure the polymer layer, wherein (a)-(b) are performed within a microwave processing chamber under vacuum.
17 . The method of claim 16 , wherein the first period of time is about 10 minutes to about 60 minutes.
18 . The method of claim 16 , wherein the second period of time is about 5 to about 60 minutes.
19 . A method of curing a polyimide layer on a substrate, comprising:
(a) applying a variable frequency microwave energy at microwave frequencies ranging from about 5.85 GHz to about 6.65 GHz, and at a sweep rate of about 0.25 microseconds per frequency, to the substrate to heat the polyimide layer and the substrate to a first temperature of about 170 to about 200 degrees Celsius, wherein the polyimide layer and the substrate are heated from about 25 degrees Celsius to the first temperature at a first rate of about 0.01 degrees Celsius to about 4 degrees Celsius per second, and wherein the polyimide layer is maintained at the first temperature for a first period of time of about 10 minutes to about 60 minutes; and
(b) adjusting the variable frequency microwave energy to increase a temperature of the polyimide layer and the substrate to a second temperature of about 300 to about 400 degrees Celsius to cure the polyimide layer, wherein the polyimide layer and the substrate are heated from the first temperature to the second temperature at a second rate of about 0.01 degrees Celsius to about 4 degrees Celsius per second, and wherein the polyimide layer is maintained at the second temperature for a second period of time of about 5 to about 60 minutes, and wherein (a)-(b) are performed within a microwave processing chamber under vacuum.
20 . The method of claim 19 , further comprising:
(c) adjusting the variable frequency microwave energy to decrease the temperature of the polyimide layer and the substrate to a third temperature less than the second temperature, wherein the third temperature is about 250 to about 350 degrees Celsius, and wherein the temperature of the polyimide layer and the substrate is decreased from the second temperature to the third temperature at a third rate of about 0.01 degrees Celsius to about 4 degrees Celsius per second, and wherein the polyimide layer is maintained at the third temperature for a third period of time of about 30 minutes, and wherein (c) is performed within the microwave processing chamber under vacuum.