IP Library Assignment 046004/0631
Patent Assignment
Reel/Frame 046004/0631

Assignment of Assignor's Interest

Recorded: 2018-06-06 Pages: 6
Assignor
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (22)
Structure and Method of Fabricating Three-Dimensional (3D) Metal-Insulator-Metal (Mim) Capacitor and Resistor in Semi-Additive Plating Metal Wiring
Patent: 9,954,051 →
Application: 15/288,594 →
Publication: US 2017/0104056
Methods for Polymer Coefficient of Thermal Expansion (Cte) Tuning by Microwave Curing
Application: 15/451,603 →
Publication: US 2017/0365490
Methods and Apparatus for Detecting Microwave Fields in a Cavity
Application: 15/649,600 →
Publication: US 2019/0018053
Semiconductor Substrate Having Magnetic Core Inductor and Method of Making Same
Application: 62/544,744 →
Target Profile for a Physical Vapor Deposition Chamber Target
Patent: 851,613 →
Application: 29/621,221 →
Methods for Chemical Mechanical Polishing (Cmp) Processing with Ozone
Application: 15/728,604 →
Methods and Apparatus for Correcting Substrate Deformity
Application: 15/811,575 →
Publication: US 2018/0218928
Hybrid Substrate Carrier
Application: 15/815,673 →
Publication: US 2018/0144969
Process Kit Having a Floating Shadow Ring
Application: 15/814,696 →
Publication: US 2018/0142340
Substrate Carrier System Utilizing Electrostatic Chucking to Accommodate Substrate Size Heterogeneity
Application: 15/827,845 →
Publication: US 2018/0112310
Textured Processing Chamber Components and Methods of Manufacturing Same
Application: 15/836,391 →
Publication: US 2019/0177835
Methods and Apparatus for Wafer-Level Die Bridge
Application: 15/835,909 →
Publication: US 2019/0181092
Non-Contact Substrate Temperature Measurement Technique Based on Spectral Inteferometry
Application: 15/887,446 →
Publication: US 2018/0226282
Bridging Front Opening Unified Pod (Foup)
Application: 62/626,762 →
Apparatus for Handling Various Sized Substrates
Application: 62/631,354 →
Deposition Ring for Processing Reduced Size Substrates
Application: 62/631,674 →
Processing Kit for Processing Reduced Sized Substrates
Application: 62/631,672 →
Methods and Apparatus for Embedded Antifuses
Application: 62/643,915 →
Bridging Front Opening Unified Pod (Foup)
Application: 15/956,481 →
Publication: US 2019/0244845
Two Piece Shutter Disk Assembly with Self-Centering Feature
Application: 62/659,683 →
Image Based Substrate Mapper
Application: 15/958,327 →
Publication: US 2018/0323095
Methods and Apparatus for Microwave Leakage Reduction for Semiconductor Process Chambers
Application: 62/660,415 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 10, 2017
From: OW, YUEH SHENG; WANG, RUI; KOH, TUCK FOONG; WANG, XIN
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 041942/0141 →
Assignment of Assignor's Interest Aug 8, 2017
From: MORI, GLEN T.
To: APPLIED MATERIALS, INC.
Reel/Frame 043232/0397 →
Assignment of Assignor's Interest Aug 28, 2017
From: SEE, GUAN HUEI; TOH, CHIN HOCK; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 043421/0557 →
Assignment of Assignor's Interest Oct 16, 2017
From: SUO, PENG; GU, YU; SEE, GUAN HUEI; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 043870/0672 →
Assignment of Assignor's Interest Dec 1, 2017
From: JOHANSON, WILLIAM; MAZZOCCO, JOHN; SAVANDAIAH, KIRANKUMAR; PRABHU, PRASHANT
To: APPLIED MATERIALS, INC.
Reel/Frame 044276/0485 →
Assignment of Assignor's Interest Jan 4, 2018
From: THIRUNAVUKARASU, SRISKANTHARAJAH; LEW, JEN SERN
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 044533/0804 →
Assignment of Assignor's Interest Jan 4, 2018
From: HSIUNG, CHIEN-KANG; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS, INC.
Reel/Frame 044533/0080 →
Assignment of Assignor's Interest Jan 10, 2018
From: ELUMALAI, KARTHIK; ZHU, MINGWEI
To: APPLIED MATERIALS, INC.
Reel/Frame 044586/0259 →
Assignment of Assignor's Interest Jan 25, 2018
From: SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 044730/0008 →
Assignment of Assignor's Interest Jan 25, 2018
From: YEN, ONG PANG; LAM, LIT PING
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 044731/0279 →
Assignment of Assignor's Interest Feb 1, 2018
From: HSIUNG, CHIEN-KANG
To: APPLIED MATERIALS, INC.
Reel/Frame 044801/0404 →
Assignment of Assignor's Interest Mar 1, 2018
From: THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG; LIM, FANG JIE; PARATHITHASAN, KARRTHIK
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045079/0104 →
Assignment of Assignor's Interest Mar 1, 2018
From: PARATHITHASAN, KARRTHIK; LIM, FANG JIE; THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045078/0852 →
Assignment of Assignor's Interest Mar 1, 2018
From: PARATHITHASAN, KARRTHIK; LIM, FANG JIE; THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045079/0287 →
Assignment of Assignor's Interest Mar 1, 2018
From: THIRUNAVUKARASU, SRISKANTHARAJAH; PEH, ENG SHENG; PARATHITHASAN, KARRTHIK; LIM, FANG JIE
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045079/0451 →
Assignment of Assignor's Interest Mar 13, 2018
From: HOI, SIEW KIT; JUPUDI, ANANTHKRISHNA; OW, YUEH SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045181/0975 →
Assignment of Assignor's Interest Mar 21, 2018
From: JOHANSON, WILLIAM; SAVANDAIAH, KIRANKUMAR; CHAN, ANTHONY CHIH-TANG; PRABHU, PRASHANT PRABHAKAR
To: APPLIED MATERIALS, INC.
Reel/Frame 045302/0666 →
Assignment of Assignor's Interest Mar 21, 2018
From: HOI, SIEW KIT
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045302/0484 →
Assignment of Assignor's Interest Apr 2, 2018
From: SUO, PENG; GU, YU; SEE, GUAN HUEI; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045410/0471 →
Assignment of Assignor's Interest Apr 9, 2018
From: HSIUNG, KUMA; BERGMAN, ERIC J.; KLOCKE, JOHN L.
To: APPLIED MATERIALS, INC.
Reel/Frame 045477/0691 →
Assignment of Assignor's Interest Apr 9, 2018
From: LIANTO, PRAYUDI; RAFI, MOHAMED; AZIM, MUHAMMAD; SEE, GUAN HUEI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045477/0583 →
Assignment of Assignor's Interest Apr 11, 2018
From: BADUVAMANDA, CARIAPPA
To: APPLIED MATERIALS, INC.
Reel/Frame 045507/0963 →
Assignment of Assignor's Interest Apr 11, 2018
From: JUPUDI, ANANTHKRISHNA; OW, YUEH SHENG; RAO, PREETHAM; RAMACHANDRAN, VINODH
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 045506/0834 →
Assignment of Assignor's Interest Apr 17, 2018
From: NEWMAN, JACOB; WADA, YUICHI
To: APPLIED MATERIALS, INC.
Reel/Frame 045559/0755 →
Assignment of Assignor's Interest May 1, 2018
From: VAYYAPRON, SHOJU; ELUMALAI, KARTHIK; RAJAPAKSA, DIMANTHA; TATTI, ARUNKUMAR M.
To: APPLIED MATERIALS, INC.
Reel/Frame 045681/0227 →