Patent Assignment
Reel/Frame 043421/0557
Assignment of Assignor's Interest
Recorded: 2017-08-28
Pages: 5
Assignors
SEE, GUAN HUEI
Executed: 2016-10-11
TOH, CHIN HOCK
Executed: 2017-07-08
SUNDARRAJAN, ARVIND
Executed: 2017-08-16
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Structure and Method of Fabricating Three-Dimensional (3D) Metal-Insulator-Metal (Mim) Capacitor and Resistor in Semi-Additive Plating Metal Wiring
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.