Patent Assignment
Reel/Frame 044730/0008
Assignment of Assignor's Interest
Recorded: 2018-01-25
Pages: 3
Assignor
SUNDARRAJAN, ARVIND
Executed: 2018-01-16
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Wafer-Level Die Bridge
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2018
From: HSIUNG, CHIEN-KANG; SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS, INC.
Reel/Frame 044533/0080 →
Assignment of Assignor's Interest
Feb 1, 2018
From: HSIUNG, CHIEN-KANG
To: APPLIED MATERIALS, INC.
Reel/Frame 044801/0404 →
Assignment of Assignor's Interest
Jun 6, 2018
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 046004/0631 →