IP Library › Assignment 044533/0080
Patent Assignment
Reel/Frame 044533/0080

Assignment of Assignor's Interest

Recorded: 2018-01-04 Pages: 3
Assignors
HSIUNG, CHIEN-KANG
Executed: 2017-12-20
SUNDARRAJAN, ARVIND
Executed: 2017-12-20
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Methods and Apparatus for Wafer-Level Die Bridge
Application: 15/835,909 →
Publication: US 2019/0181092
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 25, 2018
From: SUNDARRAJAN, ARVIND
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 044730/0008 →
Assignment of Assignor's Interest Feb 1, 2018
From: HSIUNG, CHIEN-KANG
To: APPLIED MATERIALS, INC.
Reel/Frame 044801/0404 →
Assignment of Assignor's Interest Jun 6, 2018
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 046004/0631 →