Packaged LEDs with phosphor films, and associated systems and methods

1. A method for manufacturing an LED system, the method comprising:

mounting an LED to a support member;

electrically connecting the LED to the support member with a wire bond;

electrically connecting the LED to an electrostatic discharge (ESD) die, wherein the ESD die is electrically coupled to the support member with an inner wire bond, and wherein the inner wire bond is positioned between the wire bond and the support member;

providing a self-supporting phosphor film having a nonuniform distribution of phosphor elements;

conforming the phosphor film to the wire bond such that the phosphor film contacts at least a portion of the wire bond between the LED and the support member; and

attaching the phosphor film to the LED and the support member.

2. The method of claim 1 wherein conforming includes heating the phosphor film when the phosphor film is at least partially cured and surrounding the portion of the wire bond with the phosphor film, and wherein attaching the phosphor film includes further curing the phosphor film.

3. The method of claim 1 wherein the LED is one of multiple LED dies forming at least a portion of an LED wafer, and wherein attaching the phosphor film to the LED includes attaching the phosphor film to multiple LED dies of the wafer prior to dicing the LED dies from the wafer.

4. The method of claim 1 wherein the phosphor film comprises a first layer including matrix material, and a second layer including phosphor elements, wherein the second layer is disposed in surface-to-surface contact with the first layer when the phosphor film is conformed to the wire bond.

5. The method of claim 1 wherein conforming includes conforming the phosphor film after the LED has been singulated from an LED wafer.

6. The method of claim 1 wherein conforming includes conforming the phosphor film before the LED has been singulated from an LED wafer.

7. The method of claim 1 wherein the phosphor film is attached to a carrier having a stiffness greater than a stiffness of the phosphor film, and a composition different than a composition of the phosphor film.

8. The method of claim 7 wherein the carrier includes a lens portion positioned to redirect light emitted by the LED.

9. The method of claim 1 , further comprising forming the phosphor film by:

mixing phosphor elements with a matrix material; and

at least partially curing the matrix material.

10. The method of claim 1 wherein the LED is a first LED having a first output characteristic, the support member is a first support member, the wire bond is a first wire bond and the phosphor film is a first phosphor film having a first phosphor characteristic, and wherein the method further comprises:

mounting a second LED to a second support member, the second LED having a second output characteristic different than the first output characteristic;

electronically connecting the second LED to the second support member with a second wire bond;

conforming a second shape-retaining, self-supporting phosphor film to the second wire bond over at least a portion of the second wire bond between the second LED and the second support member, the second phosphor film having a second phosphor characteristic different than the first phosphor characteristic to at least partially compensate for the difference between the first output characteristic and the second output characteristic; and

attaching the second phosphor film to the second LED and the second support member.

11. The method of claim 10 wherein the first output characteristic is a first color characteristic and wherein the second output characteristic is a second color characteristic different than the first color characteristic.

12. The method of claim 11 wherein the first color characteristic is a first wavelength and the second color characteristic is a second wavelength different than the first wavelength.

13. The method of claim 1 wherein the phosphor film includes a first side and a second side opposite the first side, and wherein attaching the phosphor film to the support member includes attaching the first side of the phosphor film to the support member, the method further comprising, before attaching the phosphor film to the support substrate, attaching a carrier to the second side of the phosphor film.

14. The method of claim 1 wherein the LED is electrically connected directly to the support member via the wire bond.

15. A method for manufacturing a semiconductor device, the method comprising:

providing a support member and an LED disposed on the support member;

providing a self-supporting phosphor film having a nonuniform distribution of phosphor elements;

electrically coupling the LED to the support member via a wire bond;

electrically connecting the LED to an electrostatic discharge (ESD) die, wherein the ESD die is electrically coupled to the support member with an inner wire bond, and wherein the inner wire bond is positioned between the wire bond and the support member; and

disposing the phosphor film over at least a portion of the wire bond, the inner wire bond, the LED, and the support member, wherein the disposed phosphor film is in contact with the wire bond.

16. The method of claim 15 wherein the phosphor film includes phosphor elements.

17. The method of claim 15 wherein providing the support member and LED comprises providing the support member, LED, and a plurality of other LEDs disposed over the support member, wherein the phosphor film extends continuously over a surface of the support member.

18. The method of claim 15 wherein disposing includes conforming the phosphor film over the wire bond, and wherein the phosphor film comprises a first layer including matrix material, and a second layer including phosphor elements, wherein the second layer is disposed in surface-to-surface contact with the first layer when the phosphor film is conformed over the wire bond.