IP Library Granted Patent US 9,923,005
Granted Patent B2
US 9,923,005 · App. 15/465,084 · Granted Mar 20, 2018

Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus

Inventor: Hiroaki Ishiwata (Tokyo, JP)
Assignee: SONY CORPORATION
H01L27/14612H01L27/14603H01L27/14605H01L27/14621H01L27/14627H01L27/14641H01L27/14645H01L27/14685H04N5/2253H04N5/2254H04N5/347H04N5/357H04N5/3696H04N5/3745H04N5/37457H04N9/045
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Quick Facts
Patent No.
US 9,923,005
App. No.
15/465,084
Granted
Mar 20, 2018
Kind
B2
Abstract

A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels includes: a plurality of photoelectric conversion portions; a plurality of transfer gates, each of which is disposed in each of the photoelectric conversion portions to transfer signal charges from the photoelectric conversion portion; and a floating diffusion to which the signal charges are transferred from the plurality of the photoelectric conversion portions by the plurality of the transfer gates, wherein the plurality of the photoelectric conversion portions receive light of the same color to generate the signal charges, and wherein the signal charges transferred from the plurality of the photoelectric conversion portions to the floating diffusion are added to be output as an electrical signal.

Claims (19)

1. An imaging device comprising:

a first photoelectric conversion element;

a second photoelectric conversion element;

a first transfer transistor;

a second transfer transistor;

a first floating diffusion region electrically connected to the first photoelectric conversion element via the first transfer transistor;

a second floating diffusion region electrically connected to the second photoelectric conversion element via the second transfer transistor;

a signal line;

an amplification transistor configured to output an electrical signal to a column circuit via the signal line; and

a wire line,

wherein,

the signal line extends along a first direction,

the first floating diffusion region and second floating diffusion region are arranged along a second direction that is different from the first direction,

the first floating diffusion region and the second floating diffusion region are formed in the semiconductor substrate, and

a gate of the amplification transistor is electrically connected to the first floating diffusion region and the second floating diffusion region via the wire line.

2. The imaging device of claim 1 , wherein the first direction is perpendicular to the second direction.

3. The imaging device of claim 1 , wherein a part of the wire line has T shape in a plan view.

4. The imaging device of claim 1 , wherein the imaging device further comprising a reset transistor.

5. The imaging device of claim 1 , wherein the first photoelectric conversion element and the second photoelectric conversion element are configured to receive the same colored light.

Priority Claims (1)
JP 2010-107265 · May 7, 2010 · national
Continuity (4)
Continuation 15156564 · May 17, 2016
Continuation 14495318 · Sep 24, 2014
Continuation 13085676 · Apr 13, 2011
Related Publication 20170194371A1 · Jul 6, 2017