IP Library Granted Patent US 10,801,977
Granted Patent B2
US 10,801,977 · App. 15/465,910 · Granted Oct 13, 2020

Radiation analyzing apparatus and radiation analyzing method

Inventors: Atsushi Nagata (Tokyo, JP); Satoshi Nakayama (Tokyo, JP); Keiichi Tanaka (Tokyo, JP); Kazuo Chinone (Tokyo, JP)
Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
G01N23/223G01N2223/33
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Quick Facts
Patent No.
US 10,801,977
App. No.
15/465,910
Granted
Oct 13, 2020
Kind
B2
Abstract

A radiation analyzing apparatus includes a radiation irradiation unit configured to irradiate an object with a first radiation, a radiation detection unit configured to detect a second radiation generated from the object irradiated with the first radiation, a radiation converging unit configured to disposed between the object and the radiation detection unit and to converge the second radiation on the radiation detection unit, a position changing unit configured to vary a relative positional relationship between the radiation converging unit and the radiation detection unit, and a driving unit configured to change the positional relationship.

Claims (23)

1. A radiation analyzing apparatus comprising:

a radiation irradiation unit configured to irradiate an object with a first radiation;

a radiation detection unit configured to detect a second radiation generated from the object which is irradiated with the first radiation;

a radiation converging unit configured to be disposed between the object and the radiation detection unit, the radiation converging unit configured to converge the second radiation on the radiation detection unit;

a position changing unit configured to vary a relative positional relationship between the radiation converging unit and the radiation detection unit;

a driving unit configured to drive the position changing unit to change the positional relationship;

a counting rate calculation unit configured to calculate a counting rate of the second radiation detected by the radiation detection unit;

a position calculation unit configured to calculate a maximum value of a regression curve based on the counting rate calculated by the counting rate calculation unit, and to calculate a position of the radiation converging unit with respect to the radiation detection unit based on the calculated maximum value; and

a driving control unit configured to control the driving unit based on the position calculated by the position calculation unit.

2. The radiation analyzing apparatus according to claim 1 , further comprising:

another driving control unit configured to control the driving unit based on an operation received from a user.

3. The radiation analyzing apparatus according to claim 1 ,

wherein the radiation irradiation unit performs irradiation with an electron beam as the first radiation, and

wherein the radiation detection unit is a superconductive transition edge sensor detecting, as the second radiation, X-rays which is generated from the object by being irradiated with the electron beam.

4. A radiation analyzing method comprising:

irradiating an object with a first radiation by a radiation irradiation unit;

detecting a second radiation, which is generated from the object irradiated with the first radiation, by a radiation detection unit;

converging the second radiation on the radiation detection unit by a radiation converging unit disposed between the object and the radiation detection unit;

causing a driving unit to drive a position changing unit to change a relative positional relationship between the radiation converging unit and the radiation detection unit, the position changing unit configured to vary the positional relationship;

calculating a counting rate of the second radiation detected by the radiation detection unit;

calculating a maximum value of a regression curve based on the calculated counting rate;

calculating a position of the radiation converging unit with respect to the radiation detection unit based on the calculated maximum value; and

controlling the driving unit based on the calculated position.

Assignments (3)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0555 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072903/0648 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2017
From: NAGATA, ATSUSHI; NAKAYAMA, SATOSHI; TANAKA, KEIICHI; CHINONE, KAZUO
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 041681/0717 →
Priority Claims (1)
JP 2016-059811 · Mar 24, 2016 · national
Continuity (1)
Related Publication 20170276621A1 · Sep 28, 2017