Semiconductor device having work-function metal and method of forming the same
In a semiconductor device, a first active area, a second active area, and a third active area are formed on a substrate. A first gate electrode is formed on the first active area, a second gate electrode is formed on the second active area, and a third gate electrode is formed on the third active area. The first gate electrode has a first P-work-function metal layer, a first capping layer, a first N-work-function metal layer, a first barrier metal layer, and a first conductive layer. The second gate electrode has a second capping layer, a second N-work-function metal layer, a second barrier metal layer, and a second conductive layer. The third gate electrode has a second P-work-function metal layer, a third capping layer, a third N-work-function metal layer, and a third barrier metal layer. The third gate electrode does not have the first and second conductive layers.
1. A semiconductor device comprising:
a substrate having a memory cell area and a logic area;
a first active area and a second active area in the memory cell area on the substrate;
a third active area in the logic area on the substrate;
an insulating layer on the substrate, the insulating layer configured to cover the first, second, and third active areas;
a first gate electrode configured to cover a side surface of the first active area, and cross the first active area, the first gate electrode including,
a first P-work-function metal layer in the first active area,
a first N-work-function metal layer on the first P-work-function metal layer,
a first barrier metal layer on the first N-work-function metal layer, and
a first conductive layer on the first barrier metal layer, a material of the first conductive layer being different than a material from the first barrier metal layer;
a second gate electrode configured to cover a side surface of the second active area, and cross the second active area, the second gate electrode including,
a second N-work-function metal layer on the second active area,
a second barrier metal layer on the second N-work-function metal layer, and
a second conductive layer on the second barrier metal layer, a material of the second conductive layer being different than a material of the second barrier metal layer; and
a third gate electrode including,
a second P-work-function metal layer in the third active area,
a third N-work-function metal layer on the second P-work-function metal layer, and
a third barrier metal layer on the third N-work-function metal layer, wherein
the first N-work-function metal layer, the second N-work-function metal layer, and the third N-work-function metal layer include TiAlC, TiAl, or a combination thereof.
2. The semiconductor device of claim 1 , wherein the first N-work-function metal layer, the second N-work-function metal layer, and the third N-work-function metal layer are thicker than the first P-work-function metal layer and the second P-work-function metal layer.
3. The semiconductor device of claim 1 , wherein the first gate electrode and the second gate electrode are wider than the third gate electrode.
4. The semiconductor device of claim 1 , wherein the first P-work-function metal layer and the second P-work-function metal layer include titanium nitride (TiN).
5. The semiconductor device of claim 1 , wherein a width of the third gate electrode is smaller than a width first gate electrode not having the first conductive layer and a width the second gate electrode and not having the second conductive layer, respectively.
6. The semiconductor device of claim 1 , further comprising:
a fourth active area in the logic area on the substrate; and
a fourth gate electrode configured to cover a side surface of the fourth active area, and cross the fourth active area, wherein
the fourth gate electrode includes a fourth N-work-function metal layer and a fourth barrier metal layer on the fourth N-work function metal layer.
7. The semiconductor device of claim 1 , wherein
the first conductive layer fills a groove defined by the first barrier metal layer,
the second conductive layer fills a groove defined by the second barrier metal layer, and
the third barrier metal layer does not define a groove.
8. The semiconductor device of claim 1 , wherein
the third N-work-function metal layer defines a groove, and
the third barrier metal layer fills an entire portion of the groove defined by the third N-work-function metal layer.
9. A semiconductor device comprising:
a substrate having a memory cell area and a logic area and extending in a first direction and a second direction intersecting the first direction;
a first active area and a second active area in the memory cell area on the substrate;
a third active area in the logic area on the substrate;
an insulating layer on the substrate, the insulating layer configured to cover the first active area, the second active area, and the third active area;
a first gate electrode configured to pass through the insulating layer in the first direction, cover a side surface of the first active area, and cross the first active area, the first gate electrode including,
a first P-work-function metal layer in the first active area,
a first N-work-function metal layer on the first P-work-function metal layer,
a first barrier metal layer having a u-shaped cross section perpendicular to the first direction, the first barrier metal layer being on the first N-work-function metal layer, and
a first conductive layer on the first barrier metal layer, a material of the first conductive layer being different than a material of the first barrier metal layer;
a second gate electrode configured to pass through the insulating layer in the first direction, cover a side surface of the second active area, and cross the second active area, the second gate electrode including,
a second N-work-function metal layer on the second active area,
a second barrier metal layer having a u-shaped cross section perpendicular to the first direction, the second barrier metal layer being on the second N-work-function metal layer, and
a second conductive layer on the second barrier metal layer, a material of the second conductive layer being different than a material of the second barrier metal layer; and
a third gate electrode extending in the first direction, the third gate electrode including,
a second P-work-function metal layer in the third active area,
a third N-work-function metal layer on the second P-work-function metal layer, and
a third barrier metal layer on the third N-work-function metal layer, wherein
the first N-work-function metal layer, the second N-work-function metal layer, and the third N-work-function metal layer include TiAlC, TiAl, or a combination thereof.
10. The semiconductor device of claim 9 , wherein a length of the first barrier metal layer in the second direction is longer than a length of the second barrier metal layer in the second direction.
11. The semiconductor device of claim 9 , wherein a length of the first barrier metal layer in a third direction perpendicular to the first direction and the second direction is longer than a length of the second barrier metal layer in the second direction.
12. The semiconductor device of claim 11 , wherein the first conductive layer fills an inner space defined by the u-shaped cross section of the first barrier metal layer and the second conductive layer fills an inner space defined by the u-shaped cross section of the second barrier metal layer.
13. The semiconductor device of claim 9 , a width of the third gate electrode is smaller than a width the first gate electrode not having the first conductive layer and a width the second gate electrode not having the second conductive layer.
14. The semiconductor device of claim 9 , further comprising:
a fourth active area in the logic area on the substrate; and
a fourth gate electrode configured to cover a side surface of the fourth active area, and cross the fourth active area, wherein
the fourth gate electrode includes a fourth N-work-function metal layer and a fourth barrier metal layer on the fourth N-work function metal layer.
15. The semiconductor device of claim 9 , wherein
the first conductive layer fills a groove defined by the first barrier metal layer,
the second conductive layer fills a groove defined by the second barrier metal layer, and
the third barrier metal layer does not define a groove.
16. The semiconductor device of claim 9 , wherein
the third N-work-function metal layer defines a groove, and
the third barrier metal layer fills an entire portion of the groove defined by the third N-work-function metal layer.