Semiconductor device having work-function metal and method of forming the same
In a semiconductor device, a first active area, a second active area, and a third active area are formed on a substrate. A first gate electrode is formed on the first active area, a second gate electrode is formed on the second active area, and a third gate electrode is formed on the third active area. The first gate electrode has a first P-work-function metal layer, a first capping layer, a first N-work-function metal layer, a first barrier metal layer, and a first conductive layer. The second gate electrode has a second capping layer, a second N-work-function metal layer, a second barrier metal layer, and a second conductive layer. The third gate electrode has a second P-work-function metal layer, a third capping layer, a third N-work-function metal layer, and a third barrier metal layer. The third gate electrode does not have the first and second conductive layers.
1. A semiconductor device comprising:
a substrate having a first area and a second area;
a first fin active area and a second fin active area in the first area on the substrate;
a third fin active area and a fourth fin active area in the second area on the substrate;
a first gate electrode crossing the first fin active area, the first gate electrode including,
a first layer on the first fin active area and including Ti and N,
a second layer on the first layer and including Ti and N,
a third layer on the second layer and including Ti, Al and C,
a fourth layer on the third layer and including Ti and N, and
a fifth layer on the fourth layer and including W,
a second gate electrode crossing the second fin active area, the second gate electrode including,
a sixth layer on the second fin active area and including Ti and N,
a seventh layer on the sixth layer and including Ti, Al and C,
a eighth layer on the seventh layer and including Ti and N, and
a ninth layer on the eighth layer and including W,
a third gate electrode crossing the third fin active area, the third gate electrode including,
a tenth layer on the third fin active area and including Ti and N,
a eleventh layer on the tenth layer and including Ti, and N,
a twelfth layer on the eleventh layer and including Ti, Al and C, and
a thirteenth layer on the twelfth layer and including Ti and N, and
a fourth gate electrode crossing the fourth fin active area, the fourth gate electrode including,
a fourteenth layer on the fourth fin active area and including Ti and N,
a fifteenth layer on the fourteenth layer and including Ti, Al and C,
a sixteenth layer on the fifteenth layer and including Ti and N, and
a seventeenth layer on the sixteenth layer and including W,
wherein a width of the ninth layer is greater than a width of the seventeenth layer, and
wherein a thickness of the fourth layer is greater than a thickness of the first layer.
2. The semiconductor device of claim 1 , wherein a thickness of the eighth layer is greater than a thickness of the sixth layer.
3. The semiconductor device of claim 1 , wherein a thickness of the twelfth layer is greater than a thickness of the tenth layer.
4. The semiconductor device of claim 1 , wherein a thickness of the twelfth layer is greater than a thickness of the eleventh layer.
5. The semiconductor device of claim 1 , wherein a thickness of the fifteenth layer is greater than a thickness of the fourteenth layer.
6. The semiconductor device of claim 1 , wherein a PMOS area includes the first fin active area and the first gate electrode, and
wherein a NMOS area includes the second fin active area, and the second gate electrode.
7. The semiconductor device of claim 1 , wherein a PMOS area includes the third fin active area and the third gate electrode, and
wherein a NMOS area includes the fourth fin active area and the fourth gate electrode.
8. A semiconductor device comprising:
a substrate having a first area and a second area;
a first fin active area and a second fin active area in the first area on the substrate;
a first gate dielectric layer on the first fin active area;
a second gate dielectric layer on the second fin active area;
a third fin active area and a fourth fin active area in the second area on the substrate;
a third gate dielectric layer on the third fin active area;
a fourth gate dielectric layer on the fourth fin active area;
a first gate electrode crossing the first fin active area, the first gate electrode including,
a first layer on the first fin active area and including Ti and N,
a second layer on the first layer and including Ti and N,
a third layer on the second layer and including Ti, Al and C,
a fourth layer on the third layer and including Ti and N, and
a fifth layer on the fourth layer and including W,
a second gate electrode crossing the second fin active area, the second gate electrode including,
a sixth layer on the second fin active area and including Ti and N,
a seventh layer on the sixth layer and including Ti, Al and C,
a eighth layer on the seventh layer and including Ti and N, and
a ninth layer on the eighth layer and including W,
a third gate electrode crossing the third fin active area, the third gate electrode including,
a tenth layer on the third fin active area and including Ti and N,
a eleventh layer on the tenth layer and including Ti, and N,
a twelfth layer on the eleventh layer and including Ti, Al and C, and
a thirteenth layer on the twelfth layer and including Ti and N, and
a fourth gate electrode crossing the fourth fin active area, the fourth gate electrode including,
a fourteenth layer on the fourth fin active area and including Ti and N,
a fifteenth layer on the fourteenth layer and including Ti, Al and C,
a sixteenth layer on the fifteenth layer and including Ti and N, and
a seventeenth layer on the sixteenth layer and including W,
wherein a lower surface of the fifth layer is at a level higher than a lower surface of the ninth layer, and
wherein a lower surface of the ninth layer and a lower surface of the seventeenth layer are at a same level.
9. A semiconductor device comprising:
a substrate having a first area and a second area;
a first fin active area and a second fin active area in the first area on the substrate;
a third fin active area and a fourth fin active area in the second area on the substrate;
a first gate electrode crossing the first fin active area, the first gate electrode including,
a first layer on the first fin active area and including Ti and N,
a second layer on the first layer and including Ti and N,
a third layer on the second layer and including Ti, Al and C,
a fourth layer on the third layer and including Ti and N, and
a fifth layer on the fourth layer and including W,
a second gate electrode crossing the second fin active area, the second gate electrode including,
a sixth layer on the second fin active area and including Ti and N,
a seventh layer on the sixth layer and including Ti, Al and C,
a eighth layer on the seventh layer and including Ti and N, and
a ninth layer on the eighth layer and including W,
a third gate electrode crossing the third fin active area, the third gate electrode including,
a tenth layer on the third fin active area and including Ti and N,
a eleventh layer on the tenth layer and including Ti, and N,
a twelfth layer on the eleventh layer and including Ti, Al and C, and
a thirteenth layer on the twelfth layer and including Ti and N, and
a fourth gate electrode crossing the fourth fin active area, the fourth gate electrode including,
a fourteenth layer on the fourth fin active area and including Ti and N,
a fifteenth layer on the fourteenth layer and including Ti, Al and C,
a sixteenth layer on the fifteenth layer and including Ti and N, and
a seventeenth layer on the sixteenth layer and including W,
wherein a width of the ninth layer is greater than a width of the fifth layer,
wherein a thickness of the third layer is greater than a thickness of the first layer, and
wherein a thickness of the third layer is greater than a thickness of the second layer.
10. The semiconductor device of claim 9 , wherein a thickness of the eighth layer is greater than a thickness of the sixth layer.
11. The semiconductor device of claim 9 , wherein a thickness of the twelfth layer is greater than a thickness of the tenth layer, and
wherein the thickness of the twelfth layer is greater than a thickness of the eleventh layer.
12. The semiconductor device of claim 9 , wherein a thickness of the fifteenth layer is greater than a thickness of the fourteenth layer.
13. The semiconductor device of claim 9 , wherein the first layer, the second layer, the third layer, the fourth layer, and the fifth layer comprise a first P-work-function metal layer, a first capping layer, a first N-work-function metal layer, a first barrier metal layer, and a first conductive layer, respectively.
14. The semiconductor device of claim 9 , wherein the sixth layer, the seventh layer, the eighth layer, and the ninth layer comprise a second capping layer, a second N-work-function metal layer, a second barrier metal layer, and a second conductive layer, respectively.
15. The semiconductor device of claim 9 , wherein the tenth layer, the eleventh layer, the twelfth layer, and the thirteen layer comprise a second P-work-function metal layer, a third capping layer, a third N-work-function metal layer, and a third barrier metal layer, respectively.
16. The semiconductor device of claim 9 , wherein the fourteenth layer, the fifteenth layer, the sixteenth layer, and the seventeenth layer comprise a fourth capping layer, a fourth N-work-function metal layer, a fourth barrier metal layer, and a third conductive layer, respectively.
17. The semiconductor device of claim 8 ,
wherein a PMOS area includes the third fin active area, the third gate dielectric layer, and the third gate electrode, and
wherein a NMOS area includes the fourth fin active area, the fourth gate dielectric layer, and the fourth gate electrode.
18. The semiconductor device of claim 8 , further comprising:
a gate electrode spacer on the substrate,
wherein upper surfaces of the first gate dielectric layer and the first gate electrode are coplanar, and
wherein upper surfaces of the second gate dielectric layer, and the gate electrode spacer are coplanar.
19. The semiconductor device of claim 8 , further comprising:
a gate electrode spacer on the substrate,
wherein upper surfaces of the third gate dielectric layer and the third gate electrode are coplanar, and
wherein upper surfaces of the fourth gate dielectric layer, and the gate electrode spacer are coplanar.
20. The semiconductor device of claim 8 , wherein a PMOS area includes the first fin active area, the first gate dielectric layer, and the first gate electrode, and
wherein a NMOS area includes the second fin active area, the second gate dielectric layer, and the second gate electrode.