Structure and method of manufacturing a finFET device having stacked fins
View Patent ↗The present invention provides a device structure and method of forming a finFet device having stacked fins. The method of the present invention comprises: providing a substrate with a first semiconductor layer on a first insulator layer, a second insulator layer on the first semiconductor layer, and a second semiconductor layer on the second insulator layer; forming a first fin and a second fin in the second semiconductor layer; masking the first fin; and forming a third fin in the first semiconductor layer, where the second fin is stacked on the third fin. The structure of the present invention comprises: a semiconductor substrate having a first semiconductor layer on a first insulator layer, a second insulator layer on the first semiconductor layer, and a second semiconductor layer on the second insulator layer; a first and second fin formed in the second semiconductor layer; and a third fin formed in the first semiconductor layer, where the second fin is stacked on the third fin.
1. A semiconductor structure, comprising:
a semiconductor substrate having a first semiconductor layer positioned on a first insulator layer, a second insulator layer positioned on said first semiconductor layer, and a second semiconductor layer positioned on said second insulator layer;
a first and second fin formed in said second semiconductor layer; and
a third fin formed in said first semiconductor layer,wherein said second fin is stacked on said third fin,
and wherein said first semiconductor layer has a surface oriented on a first crystal plane and said second semiconductor layer has a surface oriented on a second crystal plane, said first crystal plane being oriented differently than said second crystal plane, and wherein said surface oriented on said first crystal plane is substantially parallel to said surface oriented on said second crystal plane.
2. The semiconductor structure of claim 1 , wherein said stacked fins form a first finFET and said first fin forms a second finFET.
3. The semiconductor structure of claim 2 , wherein said first finFET is a p-channel finFET and said second finFET is a n-channel finFET.
4. The semiconductor structure of claim 1 , wherein said second semiconductor layer is bonded to said second insulator layer.
5. The semiconductor structure of claim 1 , wherein a height of said third fin corresponds to a thickness of said first semiconductor layer.
6. The semiconductor structure of claim 5 , wherein said first semiconductor layer thickness ranges approximately from 40 nm to 70 nm.
7. The semiconductor structure of claim 1 , wherein a height of said first fin and said second fin correspond to a thickness of said second semiconductor layer.
8. The semiconductor structure of claim 7 , wherein said second semiconductor layer thickness ranges approximately from 40 nm to 70 nm.
9. The semiconductor structure of claim 1 , wherein a first mobility is associated with said first crystal plane and a second mobility is associated with said second crystal plane, wherein said first mobility is different from said second mobility.
10. The semiconductor structure of claim 1 , wherein sidewalls of said first and second fins are orientated on a {100} crystal plane and sidewalls of said third fin are oriented on a {110} crystal plane.
11. The semiconductor structure of claim 1 , further comprising:
a dopant implanted into each of said fins;
a gate insulator layer formed on opposing sidewalls of each of said fins;
a gate conductor layer formed on said gate insulator layer, wherein said gate conductor layer and said gate insulator layer form gate stacks;
a source region implanted in a first exposed portion of each of said fins; and
a drain region implanted in a second exposed portion of each of said fins, wherein said source and drain regions are separated by a channel region.