Semiconductor layered device with data bus
View Patent ↗Apparatuses and methods of data communication between semiconductor chips are described. An example apparatus includes: a first die including a first switch circuit that receives a plurality of data signals, and further provides the plurality of data signals to a plurality of corresponding first ports among a plurality of first data ports and a first data redundancy port; and a second die including a second switch circuit that receives the plurality of data signals from the first die at a plurality of corresponding second ports among a plurality of second data ports and a second data redundancy port and further provides the plurality of data signals to a memory array.
1. An apparatus comprising:
a plurality of first data paths;
a second data path;
a first die comprising a first switch circuit configured to receive a plurality of first data signals and a second data signal associated with the plurality of first data signals, wherein the first switch circuit is configured to:
provide the plurality of first data signals to the plurality of first data paths, respectively, and provide the second data signal to the second data path when a first operation mode is activated, and
provide one of the plurality of first data signals to the second data path and remaining ones of the first data signals to selected ones of the first data paths, respectively, when a second operation mode is activated; and
a second die comprising a second switch circuit coupled to the plurality of first data paths and the second data path,
wherein the second switch circuit is configured to provide the plurality of first data signals and the second data signal when the first operation mode is activated, and further configured to provide the plurality of first data signals when the second operation mode is activated.
2. The apparatus of claim 1 ,
wherein the plurality of first data paths comprises a plurality of first vias; and
wherein the second data path comprises a second via.
3. The apparatus of claim 2 , wherein the first die further includes a first decoder configured to receive a plurality of encoded data signals and configured to decode the encoded data signals.
4. The apparatus of claim 3 , wherein the plurality of encoded at a signals are encoded by data bus inversion (DBI).
5. The apparatus of claim 3 , wherein the first die further includes a mode register configured to include a data encoding enable bit indicative of whether data encoding is enabled, and the first decoder is activated to perform decoding responsive to the data encoding enable bit being active.
6. The apparatus of claim 3 , wherein the second die further includes a second decoder, configured to receive the plurality of encoded data signals and configured to decode the encoded data signals.
7. The apparatus of claim 6 , wherein the first die further includes a first mode register configured to include an encode enable bit indicative of whether data encoding is enabled, and the first decoder is activated to perform decoding responsive, at least in part, to the data encoding bit being active and the redundancy enable signal indicating the defective first via, and
wherein the second die further includes a second mode register configured to include a data encoding enable bit indicative of whether data encoding is enabled, wherein the second via is configured to transmit a data encoding signal, the second decoder is configured to be activated responsive, at least in part, to the data encoding bit being active and the redundancy enable signal indicating no defective first via, and the second decoder is configured to decode the plurality of encoded data signals responsive, at least in part, to the data encoding signal.
8. The apparatus of claim 2 , wherein the first switch circuit and the second switch circuit are configured to receive a redundancy enable signal indicative of a defective via among the plurality of first vias or absence of defective first via among the plurality of first vias, and
wherein the first operation mode is activated responsive, at least in part, to the redundancy enable signal indicative of absence of defective via and the second operation mode is activated responsive, at least in part, to the redundancy enable signal indicative of the defective via.
9. The apparatus of claim 8 , wherein the one of the plurality of first data signals is provided to the second via in place of the defective via.
10. The apparatus of claim 9 , wherein the second die further comprises a memory array, and
wherein the second switch circuit outputs the plurality of first data signals to write data into the memory array.