Gate planarity for FinFET using dummy polish stop
A method for forming a semiconductor device includes depositing a dielectric layer over fins formed in a semiconductor substrate. The dielectric layer includes a screen layer over tops of the fins. An etch stop feature is formed on the screen layer. The etch stop feature is patterned down to the screen layer in regions across the device. A dummy gate material formed over the fins is planarized down to the etch stop feature, a dielectric fill between gate structures patterned from the dummy gate material is planarized down to the etch stop feature and a gate conductor is planarized to the etch stop feature.
1. A semiconductor device, comprising:
at least one etch stop feature including an etch stop layer disposed above a height of fins formed on a semiconductor substrate;
a conformal screen layer providing a thickness over tops of the fins formed on the semiconductor substrate, the conformal screen layer being conformally disposed along sidewalls of the at least one etch stop feature and the fins; and
gate structures each including a gate dielectric and a gate conductor formed over the fins, the at least one etch stop feature including a height to ensure the gate structures have a minimum gate height after gate formation processing.
2. The device as recited in claim 1 , wherein the etch stop layer includes a nitride material.
3. The device as recited in claim 1 , wherein the at least one etch stop feature includes a, polysilicon or amorphous silicon, base layer employed to form one or more electrical elements from the base layer.
4. The device as recited in claim 1 , wherein the at least one etch stop feature includes a plurality of etch stop features disposed in a plurality of regions on the device.
5. The device as recited in claim 4 , wherein the plurality of regions on the device includes regions on the device where gates are not active.
6. The device as recited in claim 1 , further comprising a dielectric fill planarized down to the at least one etch stop feature between the gate structures.
7. The device as recited in claim 1 , wherein the at least one etch stop feature includes multiple layers including different materials.
8. The device as recited in claim 1 , wherein the gate structures include spacers formed on sidewalls of the gate structures.
9. The device as recited in claim 3 , wherein the base layer is employed to form a fuse.
10. The device as recited in claim 3 , wherein the base layer is employed to form a capacitor.
11. The device as recited in claim 3 , wherein the base layer is employed to form a resistor.
12. The device as recited in claim 3 , wherein the base layer includes a metal silicide.
13. A semiconductor device, comprising:
a dielectric layer disposed on a semiconductor substrate;
at least one etch stop feature including an etch stop layer disposed on a portion of the dielectric layer to be above a height of fins formed on the semiconductor substrate;
a conformal screen layer providing a thickness over tops of the fins formed on the semiconductor substrate, the conformal screen layer being conformally disposed along sidewalls of the at least one etch stop feature and the fins; and
gate structures each including a gate dielectric and a gate conductor formed over the fins, the at least one etch stop feature including a height to ensure the gate structures have a minimum gate height after gate formation processing.
14. The device as recited in claim 13 , wherein the etch stop layer includes a nitride material.
15. The device as recited in claim 13 , wherein the at least one etch stop feature includes a, polysilicon or amorphous silicon, base layer employed to form one or more electrical elements from the base layer.
16. The device as recited in claim 15 , wherein the base layer is employed to form a device selected from the group consisting of: a fuse, a capacitor and a resistor.
17. The device as recited in claim 13 , wherein the at least one etch stop feature includes a plurality of etch stop features disposed in a plurality of regions on the device, and wherein the plurality of regions on the device includes regions on the device where gates not active.
18. The device as recited in claim 13 , further comprising a dielectric fill planarized down to the at least one etch stop feature between the gate structures.
19. The device as recited in claim 13 , wherein the at least one etch stop feature includes multiple layers including different materials.
20. The device as recited M claim 13 , wherein the gate structures include spacers formed on sidewalls of the gate structures.