Substrate processing apparatus
The present disclosure provides a substrate processing apparatus including: a substrate holding unit that holds a substrate; a pressure regulator that regulates a pressure of a gas supplied into an elastic membrane; and a controller that controls the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable in order to separate the substrate from the elastic membrane.
1. A substrate processing apparatus comprising:
a top ring including an elastic membrane configured to hold a substrate;
a pressure regulator configured to regulate a pressure of a gas supplied into the elastic membrane; and
a controller configured to control the pressure regulator to make the pressure of the gas supplied into the elastic membrane variable to separate the substrate from the elastic membrane,
wherein the controller is further configured to control the pressure of the gas supplied into the elastic membrane according to a type of a substrate currently held by the top ring using the information stored in a storage including a plurality of types of substrates and a first pressure and a second pressure lower than the first pressure associated with each type of substrate.
2. The substrate processing apparatus of claim 1 , wherein the type of the substrate is a film type of a substrate.
3. The substrate processing apparatus of claim 1 , wherein the controller is configured to change the pressure of the gas in stages.
4. The substrate processing apparatus of claim 1 , further comprising:
a top ring guide configured to receive the top ring;
a nozzle formed in the top ring guide and configured to eject a pressurizing fluid toward a radially inward side of the top ring guide between the wafer and the membrane; and
a position detector formed in the top ring guide and configured to detect a position of a substrate adsorbed to the elastic membrane,
wherein the controller is further configured to change the pressure of the gas when the position of the substrate reaches a position where the nozzle is configured to eject the pressurizing fluid to a back surface of the substrate.
5. The substrate processing apparatus of claim 4 , wherein the controller is further configured to supply the gas into the elastic membrane at the first pressure before the position of the substrate reaches a position where the nozzle is configured to eject the pressurizing fluid to the back surface of the substrate, and to supply the gas into the elastic membrane at the second pressure when the position of the substrate reaches a position where the nozzle is configured to eject the pressurizing fluid to the back surface of the substrate.
6. The substrate processing apparatus of claim 5 , wherein the position detector is configured to detect a height of the back surface of the substrate adsorbed to the elastic membrane as the position of the substrate, and the controller is further configured to supply the gas into the elastic membrane at the first pressure when the height of the back surface of the substrate that is detected by the position detector is equal to or higher than a height of an ejection port of the nozzle, and to supply the gas into the elastic membrane at the second pressure lower than the first pressure when the height of the back surface of the substrate that is detected by the position detector becomes lower than the height of the ejection port of the nozzle and to eject the pressurizing fluid from the nozzle toward the back surface of the substrate.
7. The substrate processing apparatus of claim 1 , wherein the controller changes the pressure of the gas according to an inflating rate of the elastic membrane.
8. The substrate processing apparatus of claim 1 , wherein the pressure regulator is an electropneumatic regulator.