Power amplifier modules with bonding pads and related systems, devices, and methods
One aspect of this disclosure is a power amplifier module that includes a power amplifier die, a first bonding pad on a conductive trace, and a second bonding pad on a conductive trace. The die includes an on-die passive device and a power amplifier. The first bonding pad is electrically connected to the on-die passive device by a first wire bond. The second bonding pad is in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module. The second bonding pad includes a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to a second wire bond that is electrically connected to an output of the power amplifier. Other embodiments of the module are provided along with related methods and components thereof.
1. A power amplifier module having a radio frequency output, the power amplifier module comprising:
a power amplifier die including an on-die passive device and a power amplifier, the power amplifier including an output and being configured to amplify a radio frequency signal;
a first bonding pad on a conductive trace and electrically connected to the on-die passive device by a first wire bond; and
a second bonding pad on the conductive trace and electrically connected to the output of the power amplifier by a second wire bond, the second bonding pad being in a conductive path between the first bonding pad and the radio frequency output of the power amplifier module, and the second bonding pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to the second wire bond.
2. The power amplifier module of claim 1 , wherein the thickness of the nickel layer is less than 0.35 um.
3. The power amplifier module of claim 1 , wherein the thickness of the nickel layer is in a range from 0.04 um to 0.2 um.
4. The power amplifier module of claim 1 , wherein the gold layer has a thickness in a range from 0.05 um to 0.15 um.
5. The power amplifier module of claim 1 , wherein the conductive trace is a copper trace.
6. The power amplifier module of claim 1 , wherein the conductive trace is on a laminate substrate and the power amplifier die is on the laminate substrate.
7. The power amplifier module of claim 1 , wherein the on-die passive device is a capacitor.
8. The power amplifier module of claim 1 , further comprising additional wire bonds in parallel with the second wire bond.
9. The power amplifier module of claim 1 , wherein the first bonding pad includes nickel that is less than 0.5 um thick, palladium, and gold.
10. The power amplifier module of claim 1 , wherein the conductive trace includes an unplated sidewall disposed between the second bonding pad and the power amplifier die.
11. A power amplifier module comprising:
a power amplifier die including an on-die passive device and a power amplifier, the power amplifier including an output and being configured to amplify a radio frequency signal;
a first bonding pad on a conductive trace, the first bonding pad electrically connected to the on-die passive device; and
a second bonding pad on the conductive trace, the second bonding pad electrically connected to the output of the power amplifier and arranged such that current from the output of the power amplifier flowing through the second bonding pad flows away from the first ponding pad, and the second bonding pad including a nickel layer having a thickness that is less the skin depth of the nickel layer at 0.45 GHz, a palladium layer over the nickel layer, and a gold layer over the palladium layer.
12. The power amplifier module of claim 11 , wherein the thickness of the nickel layer is less than the skin depth of the nickel layer at 1.9 GHz.
13. The power amplifier module of claim 11 , wherein the thickness of the nickel layer is less than the skin depth of the nickel layer at 5 GHz.
14. The power amplifier module of claim 11 , further comprising a first wire bond electrically connecting the on-die passive device to the first bonding pad.
15. The power amplifier module of claim 14 , further comprising a second wire bond electrically connecting the output of the power amplifier to the gold layer.
16. The power amplifier module of claim 11 , wherein the conductive trace includes an unplated edge portion disposed between the second bonding pad and the power amplifier die.
17. The power amplifier module of claim 11 , wherein the power amplifier module has a radio frequency output, and the second bonding pad is in a conductive path between the first bonding pad and the radio frequency output of the power amplifier module.
18. A power amplifier module comprising:
a power amplifier die including an on-die passive device and a power amplifier, the power amplifier including an output configured to provide a radio frequency signal;
a first bonding pad on a conductive trace, the first bonding pad electrically connected to the on-die passive device; and
a second bonding pad on the conductive trace, the second bonding pad electrically connected to the output of the power amplifier and arranged such that current from the output of the power amplifier is directed away from the first ponding pad, the second bonding pad including a diffusion barrier layer having a thickness sufficiently small such that the radio frequency signal is allowed to penetrate to the conductive trace, a barrier layer over the diffusion barrier layer, and a bonding layer over the barrier layer.
19. The power amplifier module of claim 18 , wherein the diffusion barrier layer is a nickel layer and thickness of the diffusion barrier layer is in a range from 0.04 um to 0.35 um.
20. The power amplifier module of claim 18 , wherein the on-die passive device is electrically connected to the first bonding pad by a first wire bond and the power amplifier is electrically connected to the second bonding pad by a second wire bond.