IP Library Granted Patent US 10,600,354
Granted Patent B2
US 10,600,354 · App. 15/493,787 · Granted Mar 24, 2020

Small pitch direct view display and method of making thereof

Inventors: Neil Deeman (Danville, CA); Michael Jansen (Palo Alto, CA); Hyung-Chul Lee (Fremont, CA); Kai Liu (Dublin, CA); Kazunori Okui (Newark, CA)
Assignee: GLO AB
G09G3/32H05K1/0274H05K1/181H05K3/28H05K3/284H05K3/303G09G2300/0408G09G2300/0452H05K2201/0112H05K2201/10106H05K2201/10128H05K2201/10522H05K2203/1316
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Quick Facts
Patent No.
US 10,600,354
App. No.
15/493,787
Granted
Mar 24, 2020
Kind
B2
Abstract

A direct view display device includes a printed circuit board, an array of pixels located on a first side of the printed circuit board, each pixel including a plurality of light emitting diodes, and an isolation grid comprising a light absorbing material located between the pixels in the array of pixels.

Claims (37)

1. A direct view display device comprising:

a printed circuit board;

an array of pixels located on a first side of the printed circuit board, each pixel comprising a plurality of light emitting diodes (LEDs);

an isolation grid comprising a light absorbing material located between the pixels in the array of pixels, wherein the isolation grid contacts and is attached to a top surface of the printed circuit board; and

further comprising a first transparent encapsulation material layer located over the isolation grid and the array of pixels.

2. The direct view display device of claim 1 , further comprising a contamination-resistant transparent coating layer located on the first transparent encapsulation material and comprising a material that is more resistant to pick-up of contaminants than the transparent encapsulation material layer.

3. The direct view display device of claim 1 , further comprising:

driver electronics mounted on a second side of the printed circuit board; and

a second encapsulation material layer located over the driver electronics.

4. The direct view display device of claim 1 , wherein each pixel comprises a red light emitting LED, a blue light emitting LED and a green light emitting LED.

5. The direct view display device of claim 1 , wherein the isolation grid extends at least up to a height of a topmost surface of the array of pixels.

6. The direct view display device of claim 1 , wherein the isolation grid comprises a free-standing grid made of a plastic light absorbing material.

7. The direct view display device of claim 6 , wherein the light absorbing material comprises a black colored polycarbonate plastic material.

8. The direct view display device of claim 1 , wherein the isolation grid comprises a printed UV curable or thermally applied material.

9. The direct view display device of claim 8 , wherein the light absorbing material comprises a printed and UV cured black ink.

10. A method of forming a direct view display device, comprising:

providing a printed circuit board;

attaching light emitting diodes (LEDs) to a first side of the printed circuit board to form an array of pixels, each pixel comprising a plurality of the LEDs;

providing an isolation grid comprising a light absorbing material between the pixels in the array of pixels by attaching the isolation grid directly to a top surface of the printed circuit board located on the first side prior to, or after, attaching the LEDs; and

further comprising forming a first transparent encapsulation material layer over the isolation grid and the array of pixels.

11. The method of claim 10 , further comprising forming contamination-resistant transparent coating layer on the first transparent encapsulation material, the contamination-resistant transparent coating layer comprising a material that is more resistant to pick-up of contaminants than the transparent encapsulation material layer.

12. The method of claim 10 , further comprising:

providing driver electronics and the printed circuit board;

mounting the provided driver electronics on a second side of the provided printed circuit board; and

forming a second encapsulation material layer over the driver electronics prior to attaching the light emitting diodes to the first side of the printed circuit board.

13. The method of claim 10 , wherein each pixel comprises a red light emitting LED, a blue light emitting LED and a green light emitting LED.

14. The method of claim 10 , wherein the isolation grid extends at least up to a height of a topmost surface of the array of pixels.

15. The method of claim 10 , wherein providing the isolation grid comprises forming a free-standing isolation grid made of a plastic light absorbing material and attaching the free-standing isolation grid to the first side of the printed circuit board.

16. The method of claim 15 , wherein the light absorbing material comprises injection molded, black colored polycarbonate plastic material.

17. The method of claim 10 , wherein providing the isolation grid comprises printing a UV curable or thermally applied material between the pixels on the first side of the printed circuit board.

18. The method of claim 17 , wherein the light absorbing material comprises a printed, UV curable black ink which is UV cured after being printed.

19. A direct view display device comprising:

a printed circuit board;

an array of pixels located on a first side of the printed circuit board, each pixel comprising a plurality of light emitting diodes (LEDs);

an isolation grid comprising a light absorbing material located between the pixels in the array of pixels, wherein the isolation grid extends at least up to a height of a topmost surface of the LEDs in the array of pixels; and

a first transparent encapsulation material layer located over the isolation grid and the array of pixels.

20. The direct view display device of claim 19 , wherein the isolation grid is located between sides of the pixels and extends to the height of the topmost surface of the array of pixels as well as above the height of the topmost surface of the array of pixels.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2024
From: GLO TECHNOLOGIES LLC
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 068297/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2023
From: SYSONAN, INC.
To: GLO TECHNOLOGIES LLC
Reel/Frame 065178/0210 →
CHANGE OF NAME Recorded Oct 5, 2023
From: NANOSYS, INC.
To: SYSONAN, INC.
Reel/Frame 065156/0416 →
TERMINATION AND RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 059569 / FRAME 0840 Recorded Sep 7, 2023
From: FORTRESS CREDIT CORP.,
To: NANOSYS, INC.
Reel/Frame 064836/0263 →
SECURITY INTEREST Recorded Apr 1, 2022
From: NANOSYS, INC.
To: FORTRESS CREDIT CORP., AS AGENT
Reel/Frame 059569/0840 →
NUNC PRO TUNC ASSIGNMENT Recorded Aug 13, 2021
From: GLO AB
To: NANOSYS, INC.
Reel/Frame 057184/0564 →
RELEASE OF SECURITY INTEREST Recorded Apr 12, 2021
From: HERCULES CAPITAL, INC.
To: GLO AB
Reel/Frame 057210/0690 →
SECURITY INTEREST Recorded Jan 23, 2019
From: GLO AB
To: HERCULES CAPITAL INC.
Reel/Frame 048110/0063 →
ASSIGNMENT OF IP SECURITY AGREEMENT Recorded Dec 12, 2018
From: GLO AB
To: HERCULES CAPITAL, INC., AS ADMINISTRATIVE AGENT
Reel/Frame 049042/0527 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2017
From: DEEMAN, NEIL; JANSEN, MICHAEL; LEE, HYUNG-CHUL; LIU, KAI; OKUI, KAZUNORI
To: GLO AB
Reel/Frame 044074/0057 →
Continuity (2)
Provisional Application 62326255 · Apr 22, 2016
Related Publication 20170309223A1 · Oct 26, 2017