Etching substrates using ale and selective deposition

1. A method of processing substrates, the method comprising:

(a) exposing a substrate comprising a first carbon containing material to an oxidant and igniting a first plasma with a first bias power to modify a surface of the first carbon containing material; and

(b) exposing the modified surface to a second plasma at a second bias power and for a duration sufficient to remove the modified surface without sputtering.

2. The method of claim 1 , further comprising (c) selectively depositing a second carbon containing material on the substrate to fill crevices on the first carbon containing material.

3. The method of claim 1 , wherein the second bias power may be between about 30V and about 100V.

4. The method of claim 1 , wherein the oxidant is a strong oxidant.

5. The method of claim 4 , wherein the strong oxidant is oxygen.

6. The method of claim 4 , wherein the first plasma is generated using a plasma power between about 15 W and about 500 W.

7. The method of claim 4 , wherein the first bias power is between about 5V and 50V.

8. The method of claim 1 , wherein the oxidant is a weak oxidant.

9. The method of claim 8 , wherein the weak oxidant is selected from the group consisting of carbon dioxide, carbon monoxide, sulfur dioxide, nitric oxide, nitrogen, and ammonia.

10. The method of claim 8 , wherein the first plasma is generated using a plasma power between about 30 W and about 500 W.

11. The method of claim 8 , wherein the first bias power is between about 30V and about 100V.

12. The method of claim 2 , wherein selectively depositing the second carbon containing material on the substrate comprises applying a self bias at a power between about 5V and about 15V and igniting a plasma using a plasma power between about 30 W and about 500 W.

13. The method of claim 12 , wherein selectively depositing the second carbon containing material on the substrate further comprises introducing methane.

14. The method of claim 13 , wherein selectively depositing the second carbon containing material on the substrate further comprises introducing a diluent selected from the group consisting of nitrogen, helium, argon, hydrogen, and combinations thereof.

15. The method of claim 1 , wherein the first carbon containing material is selected from the group consisting of photoresist, amorphous carbon, and graphene.

16. The method of claim 1 , wherein the first carbon containing material is a photoresist patterned by extreme ultraviolet lithography.

17. The method of claim 2 , wherein (c) comprises exposing the substrate to methane to adsorb a layer of methane to the surface of the first carbon containing material and exposing the substrate to a third plasma.

18. The method of claim 17 , wherein the third plasma is generated by introducing an inert gas selected from the group consisting of helium, hydrogen, nitrogen, argon, and neon and igniting the third plasma.

19. The method of claim 1 , wherein exposing the substrate comprising the first carbon containing material to the oxidant further comprises exposing the substrate to a diluent inert gas selected from the group consisting of helium, argon, neon, krypton, and xenon.

20. The method of claim 1 , wherein the second plasma in (b) is generated by introducing an inert gas selected from the group consisting of hydrogen, helium, nitrogen, argon, and neon and igniting the second plasma.

21. The method of claim 1 , further comprising purging a chamber housing the substrate between performing (a) and (b) to remove excess oxidant from the chamber.

22. The method of claim 1 , further comprising repeating (a) and (b) in cycles.

23. The method of claim 2 , further comprising repeating (a) (c) in cycles.

24. The method of claim 1 , wherein the substrate is housed on a pedestal set to a temperature between about 0° C. and about 120° C.