Input apparatus, sensor, keyboard, and electronic apparatus
An input apparatus includes a conductive layer having flexibility, a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount, a capacitance-type sensor layer, and an intermediate layer disposed between the plurality of structures and the sensor layer. The intermediate layer has a plurality of hole portions into which the plurality of structures is pressed, respectively.
1. An input apparatus, comprising:
a conductive layer having flexibility;
a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount;
a capacitance-type sensor layer; and
an intermediate layer disposed between the plurality of structures and the capacitance-type sensor layer, wherein
the intermediate layer has a plurality of first hole portions into which the plurality of structures is pressed, respectively.
2. The input apparatus according to claim 1 , wherein
each of the plurality of structures includes a protruded portion and a pressure body, wherein the pressure body is on a top portion of the protruded portion.
3. The input apparatus according to claim 2 , wherein
the pressure body is configured by a shape given to the top portion of the protruded portion.
4. The input apparatus according to claim 3 , wherein
the shape is obtained by causing the top portion of the protruded portion to project partially or entirely uniformly.
5. The input apparatus according to claim 2 , wherein
the pressure body has a thickness equal to or more than a depth of each of the plurality of first hole portions, and wherein the depth of each of the plurality of first hole portions is equal to or less than a height of the protruded portion.
6. The input apparatus according to claim 1 , wherein
a top portion of each of the plurality of structures is thicker than a buckling portion of each of the plurality of structures.
7. The input apparatus according to claim 1 , wherein
a top portion of each of the plurality of structures includes a material having higher hardness than a buckling portion of each of the plurality of structures.
8. The input apparatus according to claim 1 , wherein
the plurality of structures is configured by an embossed film that includes a plurality of second hole portions.
9. The input apparatus according to claim 8 , wherein
each of the plurality of structures has a corresponding second hole portion of the plurality of second hole portions.
10. The input apparatus according to claim 1 , wherein
each of the plurality of structures includes a buckling portion constituted of a plurality of leg portions.
11. The input apparatus according to claim 1 , wherein
each of the plurality of structures has a vent formed therein.
12. The input apparatus according to claim 1 , wherein
the plurality of structures is disposed between the conductive layer and the intermediate layer.
13. The input apparatus according to claim 1 , wherein
the conductive layer is disposed between the plurality of structures and the intermediate layer.
14. The input apparatus according to claim 12 ,
wherein each of the plurality of structures has a side surface that is elected or tilted with respect to a front surface of the intermediate layer,
wherein each of the plurality of structures includes a base portion having a square circumference, and a protruded portion that is provided on the base portion, and
wherein the protruded portion has a conical frustum shape.
15. The input apparatus according to claim 14 , wherein
an outer circumference of the protruded portion on a bottom portion side is substantially in contact with the outer circumference of the base portion.
16. The input apparatus according to claim 12 , wherein
a support portion that supports the conductive layer is provided around each of the plurality of structures.
17. The input apparatus according to claim 16 , wherein
between a top portion of each of the plurality of structures and the conductive layer, a space is formed.
18. The input apparatus according to claim 13 , wherein
each of the plurality of structures is provided inside an outer circumference of a corresponding hole portion of the plurality of first hole portions of the intermediate layer.
19. The input apparatus according to claim 12 , wherein
each of the plurality of structures includes a base portion having a side surface that is substantially vertically erected or tilted with respect to a front surface of the intermediate layer, and a protruded portion provided on the base portion.
20. The input apparatus according to claim 12 , further comprising:
a base layer disposed between the capacitance-type sensor layer and the intermediate layer, wherein
the plurality of structures is configured by an embossed layer, and
wherein the base layer has same or substantially same linear expansion coefficient as the embossed layer.
21. The input apparatus according to claim 20 , wherein
the base layer has a plurality of second hole portions into which the plurality of structures are pressed, respectively.
22. The input apparatus according to claim 12 , wherein
the capacitance-type sensor layer includes a base material,
wherein the plurality of structures is configured by an embossed layer, and
wherein the base material has same or substantially same linear expansion coefficient as the embossed layer.
23. The input apparatus according to claim 13 , further comprising:
a base layer disposed between the plurality of structures and the conductive layer, wherein
the plurality of structures is configured by an embossed layer, and
wherein the base layer has same or substantially same linear expansion coefficient as the embossed layer.
24. The input apparatus according to claim 13 , wherein
the conductive layer includes a base material,
the plurality of structures is configured by an embossed layer, and
the base material has same or substantially same linear expansion coefficient as the embossed layer.
25. The input apparatus according to claim 1 , wherein
each of the plurality of structures includes a protruded portion, a first pressure body provided on a top portion of the protruded portion, and a second pressure body provided on the first pressure body.
26. The input apparatus according to claim 25 , wherein
the first pressure body is configured by a shape given to the top portion of the protruded portion, and
the second pressure body is configured by an adhesive film.
27. The input apparatus according to claim 1 , further comprising:
a key top layer including a plurality of keys; and
a plurality of support layers respectively disposed between the plurality of structures and the key top layer.
28. A sensor, comprising:
a conductive layer having flexibility;
a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount;
a capacitance-type sensor layer; and
an intermediate layer disposed between the plurality of structures and the capacitance-type sensor layer, wherein
the intermediate layer has a plurality of hole portions into which the plurality of structures is pressed, respectively.
29. A sensor, comprising:
a conductive layer having flexibility;
a structure, a reaction force of which is non-linearly changed with respect to a pressing amount;
a capacitance-type sensor layer; and
an intermediate layer disposed between the structure and the capacitance-type sensor layer, wherein
the intermediate layer has a hole portion into which the structure is pressed.
30. A keyboard, comprising:
a conductive layer having flexibility;
a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount;
a capacitance-type sensor layer; and
an intermediate layer disposed between the plurality of structures and the capacitance-type sensor layer, wherein
the intermediate layer has a plurality of hole portions into which the plurality of structures is pressed, respectively.
31. An electronic apparatus, comprising:
a conductive layer having flexibility;
a plurality of structures, a reaction force of which is non-linearly changed with respect to a pressing amount;
a capacitance-type sensor layer; and
an intermediate layer disposed between the plurality of structures and the capacitance-type sensor layer, wherein
the intermediate layer has a plurality of hole portions into which the plurality of structures is pressed, respectively.