Pattern measurement apparatus and defect inspection apparatus
The purpose of the present invention is to provide a pattern measurement apparatus that appropriately assesses patterns formed by patterning methods for forming patterns that do not exist on photomasks. In order to achieve this purpose, the present invention provides a pattern measurement apparatus comprising a processor that measures the dimensions of patterns formed on a sample by using data acquired by irradiating the sample with a beam, wherein the processor extracts pattern coordinate information on the basis of the data acquired by irradiating the sample with a beam, and uses the coordinate information to generate measurement reference data used when performing dimension measurements of the pattern.
1. A defect inspection apparatus comprising:
a scanning electron microscope body including an electron source to provide an electron beam to irradiate a sample, a secondary electron detector to trap secondary electrons discharged from the sample when the sample is irradiated by the electron beam, and a signal amplifier receiving output from the secondary electron detector and outputting an amplified signal, and
a processor that detects a defect on the sample using data obtained from the amplified signal upon irradiating the sample with the electron beam by comparing a first image, obtained by irradiating the sample with the electron beam, and a second image, obtained by performing autocorrelation processing on the first image.
2. The defect inspection apparatus according to claim 1 , wherein the processor generates the second image by cutting out a portion of an image obtained by performing the autocorrelation processing, and detects the defect based on determination of a correlation between the second image and the first image.
3. The defect inspection apparatus according to claim 2 , wherein the processor generates a cross-correlation map based on the determination of the correlation between the first image and the second image.
4. The defect inspection apparatus according to claim 1 , wherein the first image is obtained by reversing luminance upon irradiating the sample with the electron beam.
5. The defect inspection apparatus according to claim 4 , wherein the processor generates the first image in a case where a pattern formed on the sample is a concave pattern.