Method for etching magnetic layer including isopropyl alcohol and carbon dioxide
A method of an embodiment includes: mounting a workpiece, which includes the magnetic layer, on an electrostatic chuck provided in a processing container of a plasma processing apparatus; and etching the magnetic layer to generate plasma of a processing gas including isopropyl alcohol and carbon dioxide in the processing container. In an embodiment, a pressure of a space in the processing container is set to be 1.333 Pa or less, a temperature of the electrostatic chuck is set to be −15° C. or lower, and a partial pressure of isopropyl alcohol is set to be equal to or lower than a saturation vapor pressure of the isopropyl alcohol.
1. A method for etching a magnetic layer, comprising:
a step of mounting a workpiece on an electrostatic chuck provided in a processing container of a plasma processing apparatus, the workpiece including the magnetic layer; and
a step of etching the magnetic layer, wherein plasma of a processing gas including isopropyl alcohol and carbon dioxide is generated in the processing container and a temperature of the electrostatic chuck is set to be −15° C. or lower.
2. The method according to claim 1 ,
wherein in the step of etching the magnetic layer,
a pressure of a space in the processing container is set to be 1.333 Pa or less, and
a partial pressure of the isopropyl alcohol in the processing gas is set to be equal to or lower than a saturation vapor pressure of the isopropyl alcohol at the temperature of the electrostatic chuck.
3. The method according to claim 2 ,
wherein in the step of etching the magnetic layer, a partial pressure of the isopropyl alcohol is set to be equal to or lower than a saturation vapor pressure of the isopropyl alcohol, and be equal to or greater than 2% of the saturation vapor pressure.
4. The method according to claim 2 ,
wherein in the step of etching the magnetic layer, the temperature of the electrostatic chuck is set to be not higher than −15° C. and not lower than −50° C.
5. The method according to claim 1 ,
wherein the workpiece includes an underlying layer, a magnetic film provided on the underlying layer, and a magnetic tunnel junction layer including a lower magnetic layer, a tunnel barrier layer, and an upper magnetic layer, the magnetic tunnel junction layer being provided on the magnetic film, and
in the step of etching the magnetic layer, the magnetic film and the magnetic tunnel junction layer are etched as the magnetic layer.
6. The method according to claim 1 ,
wherein the plasma processing apparatus includes a support structure including the electrostatic chuck,
the support structure is configured to rotate the electrostatic chuck around a central axis of the electrostatic chuck, and is configured to rotate around a tilt axis perpendicular to the central axis, and
the step of etching the magnetic layer includes at least one of a step of generating the plasma with the workpiece being supported horizontally with respect to a vertical direction, and a step of generating the plasma with the workpiece being tilted with respect to the vertical direction, and with the workpiece being rotated,
wherein in the step of etching the magnetic layer, the temperature of the electrostatic chuck is set to be equal to or lower than −15° C. and be equal to or higher than −50° C.