Thermally conductive composition
View Patent ↗A thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 μm or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.
1. A thermally conductive composition comprising (A) a spherical thermally conductive filler, (B) an alkoxysilane compound represented by at least one of the following formulas (II-1) and (II-2)
wherein
x=10 to 500, and
Y═Si(CH 3 ) 2 CH═CH 2 or Si(CH 3 ) 3 , and
(C) a polyorganosiloxane, not inclusive of a dimethylpolysiloxane of the following formula (IV),
wherein
R′═—O— or —CH 2 CH 2 —, and
R 31 is independently an alkyl group having 1 to 6 carbon atoms, and
c is an integer of 5 to 100;
wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 μm or more in an amount of 30% by mass or more;
component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A);
a content ratio of component (C) in the total amount of component (B) and component (C) is 24 to 90% by mass;
the spherical thermally conductive filler of component (A) is a mixture formulated with a filler having an average particle size of 50 μm or more in an amount of 30% by mass or more and a filler having an average particle size of 40 μm or less in an amount of less than 70% by mass; and
the spherical thermally conductive filler of component (A) is selected from metal oxide powders and metal powders.
2. The thermally conductive composition according to claim 1 , wherein the spherical thermally conductive filler of component (A) is a mixture formulated with a filler having an average particle size of 50 μm or more in an amount of 30 to 60% by mass; a filler having an average particle size of 8 to 25 μm in an amount of 15 to 30% by mass; and a filler having an average particle size of less than 8 μm as a balance.
3. The thermally conductive composition according to claim 1 , wherein the spherical thermally conductive filler of component (A) is selected from aluminum oxide, zinc oxide and aluminum.
4. A heat dissipating material consisting of the thermally conductive composition according to claim 1 .
5. The thermally conductive composition according to claim 1 , wherein component (B), the alkoxysilane compound, is represented by formula (II-2).