Granted Patent B2

US 10,236,447 · App. 15/597,654 · Granted Mar 19, 2019

Abstract

Claims (45)

1. A method of repairing a light emitting device assembly, comprising:

providing a light emitting device assembly including a backplane and light emitting devices, wherein a predominant subset of pixels in the light emitting device assembly includes an empty site for accommodating a repair light emitting device;

generating a test map that identifies non-functional light emitting devices in the light emitting device assembly;

providing an assembly of a repair head and repair light emitting devices, wherein the repair light emitting devices are located only on locations that are mirror images of empty sites within defective pixels that include non-functional light emitting devices; and

transferring the repair light emitting devices from the repair head to the backplane in the empty site in the defective pixels.

2. The method of claim 1 , further comprising:

transferring the repair light emitting devices from a growth substrate to a first transfer substrate; and

transferring the repair light emitting devices from the first transfer substrate to the repair head, wherein the light emitting devices that are present in the tested light emitting device assembly and the repair light emitting devices on the backplane contain a p-n junction that is arranged in the same direction.

3. The method of claim 2 , wherein each of the repair light emitting devices is transferred twice more than an individual light emitting device in the tested light emitting device assembly and the repair head has a same shape as the backplane.

4. The method of claim 2 , wherein:

the step of transferring the repair light emitting devices from a growth substrate to a first transfer substrate is performed by laser lift-off;

the step of transferring the repair light emitting devices from the first transfer substrate to the repair head is performed by selectively exposing a first UV release tape on the first transfer substrate to UV radiation; and

the step of transferring the repair light emitting devices from the repair head to the backplane is performed by selectively exposing a second UV release tape on the repair head substrate to UV radiation.

5. The method of claim 1 , wherein:

the step of transferring the repair light emitting devices from a growth substrate to a first transfer substrate comprises:

transferring first type of repair light emitting devices from a first growth substrate to a first type first transfer substrate;

transferring second type of repair light emitting devices from a second growth substrate to a second type first transfer substrate; and

transferring third type of repair light emitting devices from a third growth substrate to a third type first transfer substrate; and

transferring the repair light emitting devices from the first transfer substrate to the repair head comprises transferring the first, the second and the third types of repair devices from the respective first, second and third types of first transfer substrates to the repair head.

6. The method of claim 1 , wherein:

the step of transferring the repair light emitting devices from a growth substrate to a first transfer substrate comprises:

transferring first type of repair light emitting devices from a first growth substrate to the first transfer substrate;

transferring second type of repair light emitting devices from a second growth substrate to the first transfer substrate; and

transferring third type of repair light emitting devices from a third growth substrate to the first transfer substrate; and

transferring the repair light emitting devices from the first transfer substrate to the repair head comprises transferring the first, the second and the third types of repair devices from the same first transfer substrate to the repair head.

7. The method of claim 6 , wherein the first, the second and the third types of repair devices are arranged on the first transfer substrate in the same configuration as the location of the empty sites in the defective pixels on the backplane.

8. The method of claim 1 , wherein:

the light emitting devices on the tested light emitting device assembly includes multiple types of light emitting devices that emit light at different peak wavelengths; and

the test map identifies multiple types of non-functional light emitting devices.

9. The method of claim 1 , wherein:

multiple types of repair light emitting devices are transferred from the repair head to the backplane; and

each repair light emitting device is of a same type as a non-functional light emitting device that is located within the defective same pixel at a respective mirror image empty site on the backplane.

10. The method of claim 1 , wherein the light emitting device assembly comprises direct view display and the light emitting devices comprise red, green and blue emitting light emitting diodes.

11. A method of manufacturing an assembly of a backplane and light emitting devices, comprising:

providing a plurality of growth substrates each comprising a central region containing central light emitting devices and a peripheral region containing repair light emitting devices;

transferring the central light emitting devices from the central region of at least one of the plurality of growth substrates to a backplane to form a light emitting device assembly including the backplane and the transferred light emitting devices, wherein a predominant subset of pixels in the light emitting device assembly includes an empty site for accommodating the repair light emitting device;

generating a test map that identifies non-functional light emitting devices in the light emitting device assembly;

transferring the repair light emitting devices from the peripheral region of at least one of the plurality of growth substrates to a first transfer substrate;

transferring the repair light emitting devices from the first transfer substrate to a second transfer substrate; and

transferring the repair light emitting devices from the second transfer substrate to the backplane in the empty site in the defective pixels.

12. The method of claim 11 , wherein the repair light emitting devices and the central light emitting devices located on one backplane are transferred from the same one of the plurality of growth substrates.

13. The method of claim 11 , wherein the repair light emitting devices and the central light emitting devices located on one backplane are transferred from different ones of the plurality of growth substrates.

14. The method of claim 11 , wherein the repair light emitting devices are arranged in the peripheral region at a lower density than a density of the central light emitting devices arranged in the central region.

15. The method of claim 11 , wherein the central light emitting devices and the repair light emitting devices on the backplane contain a p-n junction that is arranged in the same direction.

16. The method of claim 11 , wherein the light emitting device assembly comprises direct view display and the light emitting devices comprise red, green and blue emitting light emitting diodes.

Assignments (10)

Cited By (2)

US 12,439,757 US 12,557,456