IP Library Granted Patent US 10,096,718
Granted Patent B2
US 10,096,718 · App. 15/616,982 · Granted Oct 9, 2018

Transistor, electronic device, manufacturing method of transistor

Inventor: Yoshinobu Asami (Isehara, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/78648H01L27/1052H01L29/42328H01L29/42384H01L29/66969H01L29/7869H01L29/7883
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Quick Facts
Patent No.
US 10,096,718
App. No.
15/616,982
Granted
Oct 9, 2018
Kind
B2
Abstract

Reducing the power consumption of a transistor and stably controlling its threshold value. Providing a transistor comprising a first conductive layer, a first insulating layer and a second insulating layer over the first conductive layer, a semiconductor layer over the first insulating layer, a third insulating layer over the first conductive layer and the semiconductor layer, a second conductive layer over the second insulating layer, and a gate electrode over the third insulating layer. The first conductive layer is in an electrically floating state. The first conductive layer has a region overlapping with the semiconductor layer with the first insulating layer provided therebetween, a region overlapping with the second conductive layer with the second insulating layer provided therebetween, and a region overlapping with the gate electrode with the third insulating layer provided therebetween.

Claims (43)

1. A transistor comprising:

a first conductive layer over a substrate, the first conductive layer functioning as a floating gate;

a first insulating layer and a second insulating layer over the first conductive layer;

a semiconductor layer over the first insulating layer;

a third insulating layer over the semiconductor layer and the first conductive layer;

a second conductive layer over the second insulating layer, the second conductive layer functioning as a control gate; and

a third conductive layer over the third insulating layer, the third conductive layer functioning as a gate electrode,

wherein the first conductive layer comprises:

a first region overlapping with the semiconductor layer with the first insulating layer therebetween;

a second region overlapping with the second conductive layer with the second insulating layer therebetween in a channel width direction; and

a third region overlapping with the third conductive layer with the third insulating layer therebetween,

wherein a thickness of the first insulating layer is larger than a thickness of the second insulating layer, and

wherein the second conductive layer does not overlap with the semiconductor layer and the third conductive layer in a top view.

2. The transistor according to claim 1 , wherein the first conductive layer is in an electrically floating state.

3. The transistor according to claim 1 , wherein the thickness of the first insulating layer is larger than a thickness of the third insulating layer.

4. The transistor according to claim 1 , wherein the semiconductor layer comprises an oxide semiconductor.

5. The transistor according to claim 1 , further comprising:

a fourth insulating layer over the first insulating layer; and

a fourth conductive layer over the fourth insulating layer.

6. The transistor according to claim 5 , wherein the thickness of the first insulating layer is larger than a thickness of the fourth insulating layer.

7. An electronic device comprising the transistor according to claim 1 .

8. A transistor comprising:

a first conductive layer over a substrate, the first conductive layer functioning as a floating gate;

a first insulating layer and a second insulating layer over the first conductive layer;

a semiconductor layer over the first insulating layer;

a third insulating layer over the semiconductor layer and the first conductive layer;

a second conductive layer over the second insulating layer, the second conductive layer functioning as a control gate; and

a third conductive layer over the third insulating layer, the third conductive layer functioning as a gate electrode,

wherein the first conductive layer comprises:

a first region overlapping with the semiconductor layer with the first insulating layer therebetween;

a second region overlapping with the second conductive layer with the second insulating layer therebetween in a channel width direction; and

a third region overlapping with the third conductive layer with the third insulating layer therebetween,

wherein a thickness of the first insulating layer is larger than a thickness of the second insulating layer,

wherein the second conductive layer does not overlap with the semiconductor layer and the third conductive layer in a top view, and

wherein the first conductive layer is configured to be injected with a charge by applying a voltage between the second conductive layer and the third conductive layer.

9. The transistor according to claim 8 , wherein the first conductive layer is in an electrically floating state.

10. The transistor according to claim 8 , wherein the thickness of the first insulating layer is larger than a thickness of the third insulating layer.

11. The transistor according to claim 8 , wherein the semiconductor layer comprises an oxide semiconductor.

12. The transistor according to claim 8 , further comprising:

a fourth insulating layer over the first insulating layer; and

a fourth conductive layer over the fourth insulating layer.

13. The transistor according to claim 12 , wherein the thickness of the first insulating layer is larger than a thickness of the fourth insulating layer.

14. An electronic device comprising the transistor according to claim 8 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2017
From: ASAMI, YOSHINOBU
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 042647/0360 →
Priority Claims (1)
JP 2016-120670 · Jun 17, 2016 · national
Continuity (1)
Related Publication 20170365720A1 · Dec 21, 2017
Cited By (3)
US 12,349,412 US 12,484,270 US 12,720,809