Semiconductor device assemblies with lids including circuit elements
A semiconductor device package is provided. The semiconductor device package includes a stack of semiconductor dies over a substrate, the substrate including a plurality of electrical contacts, and an annular lower lid disposed over the substrate and surrounding the stack of semiconductor dies. The annular lower lid includes a lower surface coupled to the substrate, an upper surface coupled to an upper lid, and an outer surface in which is formed an opening. The semiconductor device assembly further includes a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts. The semiconductor device assembly further includes the upper lid disposed over the annular lower lid and the stack of semiconductor dies.
1. A semiconductor device package, comprising:
a stack of semiconductor dies over a substrate;
the substrate including a plurality of electrical contacts;
an annular lower lid disposed over the substrate and surrounding the stack of semiconductor dies, the annular lower lid including a lower surface coupled to the substrate, an upper surface coupled to an upper lid, and an outer surface in which is formed an opening;
a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts; and
the upper lid disposed over the annular lower lid and the stack of semiconductor dies,
wherein the opening is a first opening and the circuit element is a first circuit element, and wherein the annular lower lid includes a second opening in the outer surface, and wherein the semiconductor device package includes a second circuit element disposed in the second opening and electrically coupled to at least a second one of the plurality of electrical contacts.
2. The semiconductor device package of claim 1 , wherein the lower lid comprises a metal.
3. The semiconductor device package of claim 1 , wherein the upper lid comprises a metal.
4. The semiconductor device package of claim 1 , wherein the first circuit element is configured for wireless communication.
5. The semiconductor device package of claim 1 , wherein the first circuit element is a sensor.
6. The semiconductor device package of claim 1 , wherein the semiconductor device package includes a third circuit element disposed in the first opening and electrically coupled to at least a third one of the plurality of electrical contacts.
7. The semiconductor device package of claim 1 , wherein the lower lid includes at least one via electrically coupling the first circuit element to the first one of the plurality of electrical contacts.
8. The semiconductor device package of claim 7 , wherein the at least one via is electrically isolated from the lower lid.
9. The semiconductor device package of claim 7 , wherein the at least one via is electrically coupled to the first one of the plurality of electrical contacts by a solder joint.
10. A semiconductor device package, comprising:
a stack of semiconductor dies over a substrate;
the substrate including a plurality of electrical contacts;
a lid disposed over the substrate and surrounding the die stack, the lid including a lower surface coupled to the substrate, an upper surface above the stack of semiconductor dies, and an outer surface in which is formed an opening; and
a circuit element disposed in the opening and electrically coupled to at least a first one of the plurality of electrical contacts,
wherein the opening is a first opening and the circuit element is a first circuit element, and wherein the lid includes a second opening in the outer surface, and wherein the semiconductor device package includes a second circuit element disposed in the second opening and electrically coupled to at least a second one of the plurality of electrical contacts.
11. The semiconductor device package of claim 10 , wherein the lid comprises a metal.
12. The semiconductor device package of claim 10 , wherein the first circuit element is configured for wireless communication.
13. The semiconductor device package of claim 10 , wherein the first circuit element is a sensor.
14. The semiconductor device package of claim 10 , wherein the semiconductor device package includes a third circuit element disposed in the first opening and electrically coupled to at least a third one of the plurality of electrical contacts.
15. The semiconductor device package of claim 10 , wherein the lid includes at least one via electrically coupling the first circuit element to the first one of the plurality of electrical contacts.
16. The semiconductor device package of claim 15 , wherein the at least one via is electrically isolated from the lid.
17. The semiconductor device package of claim 15 , wherein the at least one via is electrically coupled to the first one of the plurality of electrical contacts by a solder joint.
18. The semiconductor device package of claim 10 , wherein the lid is a two-piece lid comprising an annular lower lid and an upper lid.