Transistor packages

1. A transistor package comprising:

a die case having a top surface and a bottom surface opposite from the top surface;

a source bus tab extending from a first side of the die case, wherein a portion of the source bus tab that extends from the first side is spaced apart from the top surface and the bottom surface in a direction perpendicular to the top surface;

a drain bus tab extending from a second side of the die case opposite from the first side, wherein a portion of the drain bus tab that extends from the second side is spaced apart from the top surface and the bottom surface in the direction perpendicular to the top surface; and

a gate extending from a third side of the die case, wherein the gate includes a first element and a second element, wherein the first element of the gate extends in a first direction from the die case and the second element of the gate extends in a second direction from the first element, wherein the third side of the die case is perpendicular to both the first side of the die case and the second side of the die case, wherein a portion of the gate that extends from the third side is spaced apart from the top surface and the bottom surface in the direction perpendicular to the top surface, and wherein the portions of the source bus tab and the drain bus tab that extend from the die case are spaced apart from an exterior surface of the third side in a direction perpendicular to the exterior surface of the third side.

2. The transistor package as recited in claim 1 , wherein the source bus tab and the drain bus tab have at least one of the same length, the same width or the same thickness.

3. The transistor package as recited in claim 1 , wherein at least one of the source bus tab or the drain bus tab include a first element and a second element.

4. The transistor package as recited in claim 3 , wherein the first element extends in a first direction from the die case and the second element extends in a second direction from the first element.

5. The transistor package as recited in claim 4 , wherein the second direction is ninety degrees away from the first direction.

6. The transistor package as recited in claim 1 , wherein at least one of the source bus tab or the drain bus tab include a first element, a second element and a third element.

7. The transistor package as recited in claim 6 , wherein the first element extends in a first direction from the die case, the second element extends in a second direction from the first element, and the third element extends in a third direction from the second element.

8. The transistor package as recited in claim 7 , wherein the second direction is ninety degrees away from the first direction.

9. The transistor package as recited in claim 7 , wherein the third direction is ninety degrees away from the second direction.

10. The transistor package as recited in claim 1 , wherein the second direction is ninety degrees away from the first direction.

11. The transistor package as recited in claim 1 , wherein the gate includes a third element.

12. The transistor package as recited in claim 11 , wherein the third element of the gate extends in a third direction from the second element.

13. The transistor package as recited in claim 12 , wherein the second direction is ninety degrees away from the first direction.

14. The transistor package as recited in claim 13 , wherein the third direction is ninety degrees away from the second direction.

15. A power switch assembly comprising:

a transistor package including:

a die case having a top surface and a bottom surface opposite from the top surface;

a source bus tab extending from a first side of the die case, wherein a portion of the source bus tab that extends from the first side is spaced apart from the top surface and the bottom surface in a direction perpendicular to the top surface;

a drain bus tab extending from a second side of the die case opposite from the first side, wherein a portion of the drain bus tab that extends from the second side is spaced apart from the top surface and the bottom surface in the direction perpendicular to the top surface; and

a gate extending from a third side of the die case, wherein the gate includes a first element and a second element, wherein the first element of the gate extends in a first direction from the die case and the second element of the gate extends in a second direction from the first element, wherein the third side of the die case is perpendicular to both the first side of the die case and the second side of the die case, wherein a portion of the gate that extends from the third side is spaced apart from the top surface and the bottom surface in the direction perpendicular to the top surface, and wherein the portions of the source bus tab and the drain bus tab that extend from the die case are spaced apart from an exterior surface of the third side in a direction perpendicular to the exterior surface of the third side;

a first power bus bar rail operatively connected to the source bus tab of the transistor package; and

a second power bus bar rail operatively connected to the drain bus tab of the transistor package.

16. The power switch assembly as recited in claim 15 , further comprising a printed wiring board (PWB) operatively connected to the gate extending from the third side of the die case.

17. The power switch assembly as recited in claim 15 , wherein the first and second power bus bar rails are parallel to one another.

18. The power switch assembly as recited in claim 15 , wherein the second direction is ninety degrees away from the first direction.

19. The power switch assembly as recited in claim 15 , wherein the gate includes a third element.

20. The power switch assembly as recited in claim 19 , wherein the third element of the gate extends in a third direction from the second element.