IP Library Granted Patent US 10,256,249
Granted Patent B2
US 10,256,249 · App. 15/651,719 · Granted Apr 9, 2019

Integrated structures

Inventors: Justin B. Dorhout (Boise, ID); David Daycock (Boise, ID); Kunal R. Parekh (Boise, ID); Martin C. Roberts (Boise, ID); Yushi Hu (Boise, ID)
Assignee: Micron Technology, Inc.
H01L27/11582H01L29/66666H01L29/7827H01L29/76
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Quick Facts
Patent No.
US 10,256,249
App. No.
15/651,719
Filed
Jul 17, 2017
Granted
Apr 9, 2019
Kind
B2
Art Unit
2817
USPC
257/314
Abstract

Some embodiments include an integrated structure having a conductive material, a select device gate material over the conductive material, and vertically-stacked conductive levels over the select device gate material. Vertically-extending monolithic channel material is adjacent the select device gate material and the conductive levels. The monolithic channel material contains a lower segment adjacent the select device gate material and an upper segment adjacent the conductive levels. A first vertically-extending region is between the lower segment of the monolithic channel material and the select device gate material. The first vertically-extending region contains a first material. A second vertically-extending region is between the upper segment of the monolithic channel material and the conductive levels. The second vertically-extending region contains a material which is different in composition from the first material.

Claims (22)

1. An integrated structure, comprising:

a conductive line;

a select device gate material over the conductive line and vertically spaced from the conductive line;

conductive levels over the select device gate material;

monolithic channel material adjacent the select device gate material and the conductive levels; the monolithic channel material containing a lower segment adjacent the select device gate material and an upper segment adjacent the conductive levels; the monolithic channel material being electrically coupled with the conductive line;

a first region between the lower segment of the monolithic channel material and the select device gate material; the first region comprising a first material;

a second region between the upper segment of the monolithic channel material and the conductive levels; the second region comprising a second material which is different in composition from the first material; and

wherein the monolithic channel material is spaced from the conductive line by a conductive plug; the conductive plug directly contacting both the conductive line and the monolithic channel material; the conductive line comprising a first composition, and the conductive plug comprising a second composition different from said first composition.

2. The integrated structure of claim 1 wherein the first material is an oxide and the second material is a nitride.

3. The integrated structure of claim 1 wherein the first material is silicon dioxide, and wherein the second region includes silicon nitride, aluminum oxide and silicon dioxide.

4. An integrated structure, comprising:

a metal-containing conductive line supported by a semiconductor substrate;

two or more select devices over the metal-containing conductive line;

vertically-stacked conductive levels over the select devices;

monolithic channel material containing a lower segment adjacent the select devices and an upper segment adjacent the conductive levels; the monolithic channel material being electrically coupled with the metal-containing conductive line;

a first region between the lower segment of the monolithic channel material and gates of the select devices; the first region comprising a first material;

a second region between the upper segment of the monolithic channel material and the conductive levels; the second region comprising a second material which is different in composition from the first material; and

wherein the metal-containing conductive line comprises a first composition;

wherein the monolithic channel material is spaced from the metal-containing conductive line by a conductive plug; and wherein the conductive plug comprises a second composition which is different from said first composition.

5. The integrated structure of claim 4 wherein the first material is an oxide, and wherein the second material is a nitride.

6. The integrated structure of claim 4 wherein at least two of said two or more select devices are electrically coupled to one another and electrically operated as a common unit.

7. The integrated structure of claim 4 wherein at least two of said two or more select devices are electrically operated independently of one another.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050700/0535 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046597/0393 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
SUPPLEMENT NO. 5 TO PATENT SECURITY AGREEMENT Recorded Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 043482/0776 →
SUPPLEMENT NO. 5 TO PATENT SECURITY AGREEMENT Recorded Aug 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 043483/0686 →
Continuity (2)
Continuation 14830517 · Aug 19, 2015
Related Publication 20170317098A1 · Nov 2, 2017
Cited By (1)
US 12,317,498