Light emitting diodes with enhanced thermal sinking and associated methods of operation
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
1. A light emitting diode (LED) device, comprising:
a heat sink;
an LED die thermally coupled to the heat sink, the LED die having an emission area;
a phosphor spaced apart from the LED die, the phosphor at least partially corresponding to the emission area of the LED die; and
means for conducting heat away from the phosphor to the heat sink, wherein the means for conducting heat away from the phosphor includes first, second and third conduction materials, and wherein the first and second conduction materials are separated from each other by the phosphor, and wherein the third conduction material extends between the first and second conduction materials.
2. The LED device of claim 1 , further comprising means for resisting a heat flow from the LED die to the phosphor.
3. The LED device of claim 1 wherein:
the phosphor includes a first surface and a second surface opposite the first surface; and
the first and second conduction materials conduct heat away from both the first and second surfaces of the phosphor.
4. The LED device of claim 1 wherein:
the phosphor includes a first surface and a second surface opposite the first surface; and
the first and second conduction materials conduct heat away from the phosphor along a first direction generally parallel to the first and second surfaces and along a second direction generally perpendicular to the first direction.