Memory device and fabricating method thereof
A memory device and a method for fabricating the same are provided. The memory device includes a substrate, a first active region, a second active region, a gate structure, and a capping layer. The first active region and the second active region are alternately disposed in the substrate. The gate structure is disposed in the substrate and between the first active region and the second active region. The capping layer is over the gate structure to define a void therebetween.
1. A method for fabricating a memory device, the method comprising:
forming a first active region, and a second active region laterally spaced therefrom;
forming a gate structure between the first active region and the second active region; and
forming a capping material extending between the first active region and the second active region, the capping material being positioned over the gate structure and sealing a space between the gate structure and the capping material to define a sealed void comprising:
forming a dielectric material on sidewalls of a recess and over the gate structure to form a liner; and
forming the dielectric material bridging the sidewalls of the recess to seal the space between the gate structure and the capping material.
2. The method of claim 1 , wherein sealing the space between the gate structure and the capping material to define the sealed void further comprises filling the sealed void with a gaseous material comprising at least one of nitrogen, oxygen, air, or a combination thereof.
3. The method of claim 1 , further comprising forming a gate dielectric material between the gate structure and each of the first active region and the second active region, wherein the gate dielectric material comprises at least one of an oxide or a nitride.
4. The method of claim 1 , further comprising forming at least two adjacent memory cells and forming an isolation structure therebetween, wherein forming the gate structure comprises forming two gate structures between two adjacent isolation structures.
5. The method of claim 1 , wherein forming the capping material further comprises removing at least a portion of the dielectric material.
6. The method of claim 1 , wherein forming the capping material comprises integrally forming the liner and the capping material.
7. The method of claim 1 , wherein forming the gate structure comprises forming a first portion and a second portion of a multi-layer gate structure in the recess of a substrate.
8. The method of claim 7 , further comprising forming a first oxide material over the substrate and a second oxide material over the first oxide material.
9. The method of claim 8 , further comprising forming a nitride material over at least the capping material.
10. The method of claim 9 , wherein forming the nitride material over at least the capping material comprises forming the nitride material over the capping material and the second oxide material.
11. A memory device, comprising:
a first active region, and a second active region laterally spaced therefrom;
a gate structure at least partially located between the first active region and the second active region; and
a capping material located vertically over the gate structure and extending from the first active region to the second active region, the capping material sealing a space between the gate structure and the capping material to define a sealed void.
12. The memory device of claim 11 , wherein the first active region comprises one of an n-doped region or a p-doped region and the second active region comprises the other of the n-doped region or the p-doped region.
13. The memory device of claim 11 , wherein the first active region comprises one of a source region or a drain region and the second active region comprises the other of the source region or the drain region.
14. The memory device of claim 11 , wherein the gate structure comprises a multi-layer structure including a first portion and a second portion embedded within the first portion.
15. The memory device of claim 14 , wherein the first portion comprises titanium nitride and the second portion comprises tungsten.
16. The memory device of claim 11 , further comprising a recess extending between the first active region and the second active region and into at least a portion of a substrate.
17. The memory device of claim 16 , wherein an upper surface of the gate structure is lower than an upper surface of the substrate.
18. The memory device of claim 16 , wherein the gate structure is at least partially located in the recess of the substrate.
19. The memory device of claim 16 , further comprising isolation structures located in the substrate, wherein the isolation structures comprise a dielectric material.
20. The memory device of claim 19 , wherein the first active region, the gate structure, and two second active regions are located between two isolation structures.