IP Library Granted Patent US 10,490,535
Granted Patent B2
US 10,490,535 · App. 15/674,216 · Granted Nov 26, 2019

Light-emitting apparatus

Inventor: Tsukasa Inoguchi (Kitakatsuragi-gun, JP)
Assignee: Xiamen San'an Optoelectronics Co., Ltd.
H01L25/167G02B6/0073H01L24/48H01L24/97H01L25/0753H01L33/486H01L33/56H01L33/60H01L33/62H01L33/64H05B33/06H05B33/089H01L24/45H01L33/46H01L33/641H01L2224/45015H01L2224/45144H01L2224/48091H01L2224/48106H01L2224/48227H01L2924/00014H01L2924/12041H01L2924/12042H01L2924/14H01L2924/15787H01L2924/181H01L2924/19041H01L2924/19105H01L2924/351
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Quick Facts
Patent No.
US 10,490,535
App. No.
15/674,216
Granted
Nov 26, 2019
Kind
B2
Abstract

A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern. On the account of this, the light-emitting apparatus package in which heat is excellently discharged and light is efficiently utilized and a light-emitting apparatus in which the light-emitting apparatus package is used can be obtained.

Claims (11)

1. A light-emitting apparatus comprising:

a ceramic package, the entire ceramic package being made only of silicon carbide, alumina, or aluminum nitride;

a conductive pattern formed on said ceramic package;

a light-emitting device mounted on a mounting area of said ceramic package, including an electrode electrically connected to said conductive pattern; and

a metal layer including (i) a first region located under the light-emitting device and (ii) a second region located under the conductive pattern,

the second region of the metal layer being embedded in said ceramic package,

a thickness of said ceramic package between a top surface of the second region of the metal layer embedded in said ceramic package and a bottom surface of said conductive pattern formed on said ceramic package being smaller than a thickness of said ceramic package between a bottom surface of the second region of the metal layer and a bottom surface of said ceramic package.

2. The light-emitting apparatus as set forth in claim 1 , wherein:

the metal layer extends from the first region to the second region.

3. The light-emitting apparatus as set forth in claim 1 , wherein:

the first region is provided on said ceramic package.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2018
From: SHARP KABUSHIKI KAISHA
To: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Reel/Frame 047331/0728 →
Priority Claims (2)
JP 2003-098554 · Apr 1, 2003 · national
JP 2003-104669 · Apr 8, 2003 · national
Continuity (7)
Division 14961514 · Dec 7, 2015
Division 14085289 · Nov 20, 2013
Continuation 13830059 · Mar 14, 2013
Division 13222739 · Aug 31, 2011
Division 12540220 · Aug 12, 2009
Division 10816736 · Apr 1, 2004
Related Publication 20170365589A1 · Dec 21, 2017