IP Library Granted Patent US 10,026,805
Granted Patent B2
US 10,026,805 · App. 15/677,400 · Granted Jul 17, 2018

Avalanche-rugged silicon carbide (SiC) power device

Inventor: Andrei Konstantinov (Sollentuna, SE)
Assignee: Farichild Semiconductor Corporation
H01L29/0619H01L29/1608H01L29/872
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Quick Facts
Patent No.
US 10,026,805
App. No.
15/677,400
Granted
Jul 17, 2018
Kind
B2
Abstract

In at least one general aspect, a silicon carbide (SiC) device can include a drift region and a termination region at least partially surrounding the SiC device. The termination region can have a first transition zone and a second transition zone. The first transition zone can be disposed between a first zone and a second zone, and the second zone can have a top surface lower in depth than a depth of a top surface of the first zone. The first transition zone can have a recess, and the second transition zone can be disposed between the second zone and a third zone.

Claims (59)

1. A silicon carbide (SiC) device, comprising:

a drift region of a first conductivity type;

a termination region at least partially surrounding the SiC device; and

a rim having a second conductivity type and at least partially surrounding the SiC device,

the termination region at least partially surrounding the rim and having the second conductivity type, the termination region having:

a first transition zone, and

a second transition zone,

the first transition zone being disposed between a first zone and a second zone, the second zone having a top surface lower in depth than a depth of a top surface of the first zone, the first transition zone having a recess,

the second transition zone being disposed between the second zone and a third zone.

2. The SiC device of claim 1 , wherein the third zone has a top surface lower in depth than the top surface of the second zone, the second transition zone has a recess.

3. The SiC device of claim 1 , wherein the first zone has a depth equal to a depth of a doped region of the second zone.

4. The SiC device of claim 1 , wherein the first transition zone has a doped region having a depth that is the same as a depth of the doped region of the first zone and as a depth of the doped region of the second zone.

5. The SiC device of claim 1 , wherein the first transition zone has an edge defined by a step.

6. The SiC device of claim 1 , further comprising:

a shielding body defined by a trench and a shielding body doped region, the shielding body doped region has a thickness at least one third of a depth of the trench.

7. The SiC device of claim 1 , wherein the drift region has a first conductivity type,

the SiC device further comprising:

a shielding body; and

a Schottky region,

the rim at least partially surrounding the shielding body and the Schottky region.

8. The SiC device of claim 7 , further comprising:

a shielding body having a shielding body doped region, the shielding body having a doping concentration the same as the doping concentration of a rim doped region of the rim.

9. A silicon carbide (SiC) device, comprising:

a drift region of a first conductivity type;

a rim having a second conductivity type and at least partially surrounding the SiC device; and

a termination region at least partially surrounding the rim and having the second conductivity type, the termination region having a first zone having a doped region with a first thickness, the termination region having a second zone having a doped region with a second thickness different from the first thickness, the first zone having a top surface higher than a top surface of the second zone,

the termination region having:

a first transition zone, and

a second transition zone,

the first transition zone being disposed between the first zone and the second zone,

the second transition zone being disposed between the second zone and a third zone.

10. The SiC device of claim 9 , wherein the first transition zone and the second transition zone each have a recess.

11. The SiC device of claim 9 , wherein the third zone has a top surface lower in depth than the top surface of the second zone.

12. The SiC device of claim 9 , wherein the doped region of the first zone has a depth equal to a depth of the doped region of the second zone.

13. The SiC device of claim 9 , wherein the first transition zone has a doped region having a depth that is the same as a depth of the doped region of the first zone and as a depth of the doped region of the second zone.

14. The SiC device of claim 9 , wherein the drift region has a first conductivity type,

the SiC device further comprising:

an array of a plurality of shielding bodies interleaved with a plurality of Schottky regions,

the rim at least partially surrounding the array.

15. The SiC device of claim 14 , wherein

the first zone is disposed between the rim and the first transition zone,

the first zone has a top surface that is substantially flat, and

the second zone has a top surface that is substantially flat and lower in depth than a depth of the top surface of the first zone.

16. The SiC device of claim 14 , wherein at least one of the plurality of shielding bodies is defined by a trench and a shielding body doped region, the shielding body doped region has a thickness at least one third of a depth of the trench.

17. The SiC device of claim 10 , wherein the doped region of the first zone on a first side of the first transition zone has a relatively high charge, and the doped region of the second zone on a second side of the first transition zone has a relatively low charge.

18. A silicon carbide (SiC) device, comprising:

a drift region;

a termination region including a first transition zone disposed between a first zone and a second zone, and a second transition zone disposed between the second zone and a third zone,

the termination region at least partially surrounding the SiC device,

the second zone having a top surface lower in depth than a depth of a top surface of the first zone,

the depth of the top surface of the second zone being lower than a depth of a top surface of the third zone,

the first transition zone having a recess,

the second transition zone having a recess.

19. The SiC device of claim 18 , wherein the first zone has doped region with a depth equal to a depth of a doped region of the second zone and equal to a depth of a doped region of the third zone.

20. The SiC device of claim 18 , wherein the drift region has a first conductivity type,

the SiC device further comprising:

a shielding body; and

a Schottky region,

a rim having a second conductivity type and at least partially surrounding the shielding body and the Schottky region, the termination region having the second conductivity type and at least partially surrounding the rim.

Assignments (9)
SECURITY INTEREST Recorded Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 058871, FRAME 0799 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 046530, FRAME 0460 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →
SECURITY INTEREST Recorded Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
PATENT SECURITY AGREEMENT Recorded Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2017
From: KONSTANTINOV, ANDREI
To: TRANSIC AB
Reel/Frame 043296/0519 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2017
From: TRANSIC AB
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 043296/0574 →
Continuity (3)
Continuation In Part 15079586 · Mar 24, 2016
Provisional Application 62139368 · Mar 27, 2015
Related Publication 20170345889A1 · Nov 30, 2017