IP Library › Granted Patent US 10,669,422
Granted Patent B2
US 10,669,422 · App. 15/679,901 · Granted Jun 2, 2020

Condensation-curable silicone resin composition

Inventors: Takayuki Kusunoki (Annaka, JP); Tomoyuki Mizunashi (Annaka, JP); Yuusuke Takamizawa (Annaka, JP)
Assignee: SHIN-ETSU CHEMICAL CO., LTD.
C08L83/04C08G77/08C08K5/544C08K5/5442H01L23/296H01L33/56C08G77/16C08G77/18
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,669,422
App. No.
15/679,901
Granted
Jun 2, 2020
Kind
B2
Abstract

One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance. Thus, the present invention is to provide a condensation-curable silicone composition comprising the following components (A) to (C): (A) 100 parts by mass of an organopolysiloxane which has a branched or network structure and has two or more hydrolyzable groups each bonded to a silicon atom and at least one of (R 1 SiO 3/2 ) and (SiO 4/2 ) units, wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, (B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and (C) at least one silazane compound represented by the following general formula (3) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B):

Claims (27)

1. A LED element encapsulated with a cured product obtained by curing an encapsulating composition for semiconductor devices, wherein the encapsulating composition comprises the following components (A) to (C):

(A) 100 parts by mass of an organopolysiloxane which has a branched or network structure, has two or more hydrolyzable groups each bonded to a silicon atom and at least one (R 1 SiO 3/2 ) unit, wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms,

(B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and

(C) at least one silazane compound represented by the following general formula (3), (3′) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B):

wherein X′ is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group having 1 to 12 carbon atoms, R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, m is an integer of from 3 to 8, f is an integer of from 1 to 500, g is an integer of from 0 to 500, h is an integer of from 0 to 200, provided that the total of f, g and h is 10 to 500, the parenthesized silazane units may form a block unit or bond randomly, and X is, independently of each other, a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms, or a group represented by the following formula (4):

wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms,

provided that the composition comprises neither any amine compound catalyst besides said silazane compound nor any organic metal catalyst.

2. An encapsulating composition for semiconductor devices comprising the following components (A) to (C):

(A) 100 parts by mass of an organopolysiloxane which has a branched or network structure, has two or more hydrolyzable groups each bonded to a silicon atom and at least one (R 1 SiO 3/2 ) unit, wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms,

(B) 5 to 500 parts by mass of a linear organopolysiloxane having at least one hydrolyzable group bonded to a silicon atom at each of both terminals, and

(C) at least one silazane compound represented by the following general formula (3), (3′) or (5) or comprising the following units (6) in an amount of 0.02 to 30 parts by mass, relative to total 100 parts by mass of components (A) and (B):

wherein X′ is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group having 1 to 12 carbon atoms, R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, m is an integer of from 3 to 8, f is an integer of from 1 to 500, g is an integer of from 0 to 500, h is an integer of from 0 to 200, provided that the total of f, g and h is 10 to 500, the parenthesized silazane units may form a block unit or bond randomly, and X is, independently of each other, a hydrogen atom, a monovalent hydrocarbon group having 1 to 12 carbon atoms, or a group represented by the following formula (4):

wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms,

provided that the composition comprises neither any amine compound catalyst besides said silazane compound nor any organic metal catalyst, and further comprising a rare earth element compound.

3. The encapsulating composition for semiconductor devices according to claim 2 , wherein the rare earth element compound is at least one compound selected from the group consisting of an organic complex of a rare earth element, a rare earth element alkoxide having an alkoxy group, and an organic acid salt of a rare earth element via an organic acid.

4. The encapsulating composition for semiconductor devices according to claim 2 , wherein the rare earth element is at least one element selected from the group consisting of lanthanum, cerium, neodymium, europium, and ytterbium.

5. The encapsulating composition for semiconductor devices according to claim 2 , wherein an amount of the rare earth element is 10 to 3,000 ppm relative to a total 100 parts by mass of the components (A), (B) and (C).

6. The LED element according to claim 1 , wherein component (A) is represented by the following general formula (1):

(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (O 1/2 R 2 ) e   (1)

wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, R 2 is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group which has 1 to 6 carbon atoms and may have an oxygen atom, a is an integer of from 0 to 500, b is an integer of from 0 to 1,000, c is an integer of from 1 to 500, d is an integer of from 0 to 500, provided that a total of c and d is 3 to 500, e is an integer of from 2 to 100, and the parenthesized silazane units may form a block unit or bond randomly.

7. The LED element according to claim 1 , wherein component (B) is represented by the following general formula (2):

wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, R 2 is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group which has 1 to 6 carbon atoms and may have an oxygen atom, k is, independently of each other, an integer of from 1 to 3, and n is an integer of from 1 to 2,000.

8. The encapsulating composition for semiconductor devices according to claim 2 , wherein component (A) is represented by the following general formula (1):

(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (O 1/2 R 2 ) e   (1)

wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, R 2 is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group which has 1 to 6 carbon atoms and may have an oxygen atom, a is an integer of from 0 to 500, b is an integer of from 0 to 1,000, c is an integer of from 1 to 500, d is an integer of from 0 to 500, provided that a total of c and d is 3 to 500, e is an integer of from 2 to 100, and the parenthesized silazane units may form a block unit or bond randomly.

9. The encapsulating composition for semiconductor devices according to claim 2 , wherein component (B) is represented by the following general formula (2):

wherein R 1 is, independently of each other, a hydrogen atom or a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 12 carbon atoms, R 2 is, independently of each other, a hydrogen atom or a monovalent hydrocarbon group which has 1 to 6 carbon atoms and may have an oxygen atom, k is, independently of each other, an integer of from 1 to 3, and n is an integer of from 1 to 2,000.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2017
From: KUSUNOKI, TAKAYUKI; MIZUNASHI, TOMOYUKI; TAKAMIZAWA, YUUSUKE
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 043341/0651 →
Priority Claims (1)
JP 2016-161363 · Aug 19, 2016 · national
Continuity (1)
Related Publication 20180051138A1 · Feb 22, 2018
Cited By (1)
US 12,473,405