Semiconductor devices including conductive pillars
A method of forming a conductive material on a semiconductor device. The method comprises removing at least a portion of a conductive pad within an aperture in a dielectric material over a substrate. The method further comprises forming a seed material at least within a bottom of the aperture and over the dielectric material, forming a protective material over the seed material within the aperture, and forming a conductive pillar in contact with the seed material through an opening in the protective material over surfaces of the seed material within the aperture. A method of forming an electrical connection between adjacent semiconductor devices, and a semiconductor device, are also described.
1. A semiconductor device, comprising:
a conductive plug in electrical communication with active circuitry of a semiconductor die;
a conductive material over the conductive plug;
a dielectric material over the conductive material comprising an aperture exposing at least a portion of the conductive material;
a seed material within the aperture and in electrical contact with the conductive material;
a protective material within the aperture comprising an opening exposing a portion of the seed material at a bottom of the aperture; and
a conductive pillar over surfaces of the protective material and over surfaces of the seed material.
2. The semiconductor device of claim 1 , further comprising a conductive pillar of another semiconductor die in electrical contact with a conductive element of the semiconductor die, the conductive element on a side of the semiconductor die opposite the conductive pillar.
3. The semiconductor device of claim 1 , further comprising a conductive element of a logic die in contact with the conductive pillar of the semiconductor die.
4. The semiconductor device of claim 1 , further comprising a conductive pad over the conductive material within the aperture.
5. The semiconductor device of claim 1 , wherein the conductive pillar is at least partially within the aperture.
6. The semiconductor device of claim 1 , wherein the conductive plug comprises a through-substrate via in communication with active circuitry on a front side of the semiconductor device.
7. A semiconductor device, comprising:
a conductive plug in electrical communication with active circuitry of a semiconductor die;
a conductive material over the conductive plug;
a dielectric material over the conductive material comprising an aperture exposing at least a portion of the conductive material;
a seed material within the aperture and in electrical contact with the conductive material;
an insulative material within the aperture comprising an opening exposing a portion of the seed material at a bottom of the aperture; and
a conductive trace comprising a portion over surfaces of the insulative material and over surfaces of the seed material and extending laterally from the aperture over the dielectric material to a remote location.
8. The semiconductor device of claim 7 , further comprising a conductive bump over the conductive trace at the remote location.
9. The semiconductor device of claim 7 , wherein the seed material comprises aluminum, copper, or combinations thereof.
10. The semiconductor device of claim 7 , wherein the seed material comprises an adhesion material and a copper material.
11. The semiconductor device of claim 10 , wherein the adhesion material is in direct contact with the conductive material and the copper material is in direct contact with the adhesion material.
12. A semiconductor device, comprising:
a conductive plug in electrical communication with active circuitry of a semiconductor die;
a conductive material over the conductive plug;
a dielectric material over the conductive material;
a seed material in electrical contact with the conductive material;
a protective material over sidewalls and a portion of horizontal surfaces of the seed material; and
a conductive pillar in contact with the protective material and the seed material.
13. The semiconductor device of claim 12 , wherein side surfaces of the seed material are substantially coplanar with side surfaces of the protective material.
14. The semiconductor device of claim 12 , further comprising a conductive pad material over the conductive material.
15. The semiconductor device of claim 14 , wherein the conductive pad material is laterally adjacent the conductive pillar and directly over the conductive material.
16. The semiconductor device of claim 12 , further comprising a conductive pad over the conductive material.
17. The semiconductor device of claim 16 , wherein the conductive pad is between the conductive material and the seed material.
18. The semiconductor device of claim 12 , further comprising a bond pad in contact with the conductive pillar.
19. The semiconductor device of claim 12 , wherein the horizontal surfaces of the seed material extend laterally beyond a width of the conductive pillar.