Protection of low temperature isolation fill

1. A semiconductor structure comprising:

a plurality of semiconductor fins on an upper surface of a semiconductor substrate, the semiconductor fins spaced apart from one another by a respective trench to define a fin pitch; and

a multi-layer electrical isolation region contained in each trench, the multi-layer electrical isolation region comprising:

an oxide layer comprising of a first material on an upper surface of the semiconductor substrate;

a protective layer comprising an annealed oxide material on an upper surface of the oxide layer, the annealed oxide material being different than the first material;

a fin protection liner formed on the plurality of semiconductor fins, the fin protection liner comprising a third material that is different from the second material of the protective layer, the fin protection liner including a lower portion interposed between the semiconductor substrate and the oxide layer and an upper portion on sidewalls and an upper surface of the plurality of semiconductor fins,

wherein the fin protection liner is directly on the oxide layer, and wherein both the oxide layer and the protective layer directly contact inner sidewalls of the fin protection liner, and

wherein the first material has a first etch resistance and the annealed oxide material has a second etch resistance that is greateer than the first etch resistance such that the annealed oxide material is configured a mask to protect the oxide layer.

2. The semiconductor structure of claim 1 , wherein the first material comprises nominally stoichiometric silicon dioxide (SiO 2 ), and wherein the second material is an oxide material containing nitrogen.

3. The semiconductor structure of claim 2 , wherein the second material is modified silicon oxide containing species selected from a group comprising nitrogen (N), helium (He), hydrogen (H), and argon (Ar), and Oxygen.

4. The semiconductor structure of claim 1 , wherein the first material comprises nominally stoichiometric silicon dioxide (SiO 2 ), and the second material which is modified SiO 2 .

5. The semiconductor structure of claim 1 , wherein the protective layer contains plasma species implanted therein in response to undergoing a plasma treatment.

6. A semiconductor structure comprising:

a plurality of semiconductor fins on an upper surface of a semiconductor substrate, the semiconductor fins spaced apart from one another by a respective trench to define a fin pitch;

an oxide material in the trenches to define an oxide layer, the oxide material having a first etch resistance;

a second material different from the oxide material on an upper surface of the oxide layer to define a first protective layer, the first protective layer containing plasma species implanted therein in response to undergoing a plasma treatment;

a third material on an upper surface of the first protective layer, the third material different from the oxide material and the second material to define a second protective layer;

a fin protection liner formed on the plurality of semiconductor fins, the fin protection liner comprising a fourth material that is different from the oxide material of the oxide layer, the second material of the first protective layer, and the third material of the second protective layer,

wherein a combination of the oxide layer, the first protective layer and the second protective layer defines a multi-layer electrical isolation region that electrically isolates the plurality semiconductor fins from one another,

wherein the fin protection liner is directly on the oxide layer, and wherein each of the oxide layer, the first protective layer and the second protective layer directly contact inner sidewalls of the fin protection liner, and

wherein each of the oxide layer, the first protective layer and the second protective layer having different etch resistances with respect to one another.

7. The semiconductor structure of claim 6 , wherein the first protective layer has an etch resistance that is greater than the oxide layer, and wherein the second protective layer has an etch resistance that is greater than both the oxide layer and the first protective layer.

8. The semiconductor structure of claim 6 , wherein the fin protection liner includes a lower portion on the semiconductor substrate.

9. The semiconductor structure of claim 8 wherein the fin protection liner includes an upper portion on sidewalls and an upper surface of the plurality of semiconductor fins.

10. The semiconductor structure of claim 9 , wherein the lower portion is interposed between the semiconductor substrate and the oxide layer.