Etching method and plasma processing apparatus

1. An etching method comprising:

a reaction layer forming step of forming a reaction layer by adsorption of a gas on a surface of an etching target material;

a desorption step of desorbing the reaction layer after the reaction layer forming step;

monitoring a thickness of the formed reaction layer; and

when the thickness of the formed reaction layer is greater than a predetermined amount, performing a removal step of removing the reaction layer remaining after the desorption step until a thickness of the formed reaction layer is within said predetermined amount,

wherein the surface of the etching target material is etched by the reaction layer forming step and the desorption step.

2. The etching method according to claim 1 , wherein the monitoring a thickness is performed by an optical method.

3. The etching method according to claim 1 , wherein

the reaction layer forming step, the desorption step, and the removing step are all performed using plasma, and

radio frequency power supplied to a sample stage on which a sample containing the etching target material is placed in the removal step is smaller than radio frequency power supplied to the sample stage in the desorption step.

4. The etching method according to claim 3 , wherein a gas used in the removal step is different from a gas used in the desorption step.

5. The etching method according to claim 1 ,

wherein said thickness is one or more of a thickness between opposing sides of an opening in at least one mask, a thickness of the formed reaction layer on said at least one mask, and a thickness of said formed reaction layer on said etching target material, and

wherein said removal step comprises removing the reaction layer remaining after the desorption step until one or more of said thickness between opposing sides of an opening in at least one mask, said thickness of the formed reaction layer on said at least one mask, and said thickness of said formed reaction layer on said etching target material is within said predetermined amount.

6. The etching method according to claim 5 ,

wherein said at least one mask comprises a first and a second mask,

wherein said thickness is one or more of a thickness between opposing sides of an opening in said first mask, a thickness between opposing sides of an opening in said second mask, a thickness of the formed reaction layer on said first mask, a thickness of the formed reaction layer on said second mask, and said thickness of said formed reaction layer on said etching target material, and

wherein said removal step comprises removing the reaction layer remaining after the desorption step until one or more of said thickness between opposing sides of said opening in said first mask, said thickness between opposing sides of said opening in said second mask, said thickness of the formed reaction layer on said first mask, said thickness of the formed reaction layer on said second mask, and said thickness of said formed reaction layer on said etching target material is within said predetermined amount.

7. An etching method comprising:

a reaction layer forming step of forming a reaction layer by adsorption of a gas on a surface of an etching target material;

a desorption step of desorbing the reaction layer after the reaction layer forming step; and

a removal step of removing a deposited film,

wherein the surface of the etching target material is etched by the reaction layer forming step and the desorption step, and

wherein the removal step is performed in a case where the thickness of the deposited film is monitored by an optical method and the monitored thickness of the deposited film is thicker than a predetermined amount.

8. An etching method comprising:

a reaction layer forming step of forming a reaction layer by adsorption of a gas on a surface of an etching target material;

a desorption step of desorbing the reaction layer after the reaction layer forming step;

monitoring a thickness of a deposited film; and

when the thickness of the deposited film is greater than a predetermined amount, performing a removal step of removing the deposited film until a thickness of the deposited film is within said predetermined amount,

wherein the surface of the etching target material is etched by the reaction layer forming step and the desorption step.