Methods of operating integrated circuit devices having volatile and nonvolatile memory portions
A method can include, by operation of a controller circuit, writing data into a volatile memory portion formed in an integrated circuit substrate of a memory device. In response to first conditions, date can be written from the volatile memory portion into a nonvolatile memory portion formed in the same integrated circuit substrate as the volatile memory portion. The nonvolatile memory portion can store the data in two terminal memory elements re-programmable between at least two different resistance states.
1. A method, comprising:
by operation of a controller circuit, writing data into a volatile memory portion formed in an integrated circuit substrate of a memory device;
in response to first conditions, writing the data from the volatile memory portion into a nonvolatile memory portion formed in the same integrated circuit substrate as the volatile memory portion; and
the nonvolatile memory portion stores the data in two terminal memory elements re-programmable between at least two different resistance states.
2. The method of claim 1 , further including:
by operation of the controller circuit, reading the data from the volatile memory portion.
3. The method of claim 1 , wherein:
the first conditions include receiving predetermined control values for the integrated circuit.
4. The method of claim 1 , wherein:
the first conditions include detecting a low power condition by operation of a power supply monitoring circuit.
5. The method of claim 4 , further including:
providing power to memory device with a back-up power supply in response to detecting the low power condition.
6. The method of claim 1 , further including:
in response to second conditions, reading the data from the nonvolatile memory portion into the volatile memory portion.
7. The method of claim 6 , wherein:
the second conditions include a power-on or reset of the memory device.
8. The method of claim 1 , wherein:
the controller circuit is formed on the same integrated circuit substrate as the volatile and nonvolatile memory portions.
9. The method of claim 1 , wherein:
the controller circuit is not formed on the same integrated circuit substrate as the volatile and nonvolatile memory portions.
10. A method, comprising:
in response to first conditions, writing first data from a nonvolatile memory portion of a memory device into a volatile memory portion of the same memory device; and
by operation of a memory controller circuit, reading the first data from the volatile memory portion onto an output memory bus of the memory device; wherein
the volatile and non-volatile memory portions are formed in a same integrated circuit substrate, and
the nonvolatile memory portion stores data in two terminal memory elements re-programmable between at least two different resistance states.
11. The method of claim 10 , wherein:
the first conditions include receiving predetermined control values for the integrated circuit.
12. The method of claim 11 , wherein:
the first conditions include a power-on or reset of the memory device.
13. The method of claim 10 , further including:
in response to second conditions, writing second data from the volatile memory portion into the nonvolatile memory portion.
14. The method of claim 13 , wherein:
the second conditions include detecting a low power condition by operation of a power supply monitoring circuit.
15. The method of claim 14 , further including:
providing power to memory device with a back-up power supply in response to detecting the low power condition.
16. A method, comprising:
storing data in
nonvolatile memory cells of a nonvolatile memory cell array of an integrated circuit device, or
volatile memory cells of a volatile memory cell array of the integrated circuit device;
in response to first conditions, by operation of a controller circuit, transferring the data between the volatile memory cells of the volatile memory cell array and the nonvolatile memory cells of the nonvolatile memory array; wherein
each nonvolatile memory cell stores at least one bit value in at least one two terminal memory element that is re-programmable between at least two different resistance states.
17. The method of claim 16 , wherein:
the first conditions are selected from the group of: receiving predetermined control values for the integrated circuit device, detecting a low power condition by operation of a power supply monitoring circuit, and a power-on or reset of the integrated circuit device.
18. The method of claim 16 , wherein:
storing data in the nonvolatile memory cells includes storing data in two terminal nonvolatile memory elements that each include a dielectric layer formed between two electrodes; wherein
the dielectric layer is programmed to one resistance value to store one data value, and programmed to another resistance value to store another data value by application of electric fields which induce an oxidation-reduction operation within the dielectric layer.
19. The method of claim 16 , wherein:
the nonvolatile memory cells each include
at least one access transistor formed in a substrate of the integrated circuit device, and
at least one nonvolatile memory element formed above the substrate.
20. The method of claim 16 , wherein:
the nonvolatile memory cell array includes nonvolatile memory cells with at least one nonvolatile memory cell access transistor;
the volatile memory cell array includes volatile memory cells with at least one volatile memory cell access transistor; and
a minimum transistor size of the nonvolatile memory cell access transistors is different than a minimum transistor size of the volatile memory cell access transistors.