MEMS actuation systems and methods
A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.
1. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:
mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes, applying epoxy to the metal plate, positioning the MEMS actuator on the epoxy, and curing the epoxy;
mounting an image sensor assembly to the MEMS actuator; and
electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly.
2. The method of manufacturing the MEMS assembly of claim 1 wherein mounting the image sensor assembly to the MEMS actuator includes:
applying epoxy to the MEMS actuator;
positioning the image sensor on the epoxy; and
curing the epoxy.
3. The method of manufacturing the MEMS assembly of claim 1 wherein electrically coupling the image sensor assembly to the MEMS actuator includes:
wirebonding the image sensor assembly to the MEMS actuator.
4. The method of manufacturing the MEMS assembly of claim 1 further comprising:
mounting the MEMS subassembly to a printed circuit board.
5. The method of manufacturing the MEMS assembly of claim 4 wherein mounting the MEMS subassembly to the printed circuit board includes:
applying epoxy to the printed circuit board;
positioning the MEMS subassembly on the epoxy; and
curing the epoxy.
6. The method of manufacturing the MEMS assembly of claim 4 further comprising:
electrically coupling the MEMS subassembly to the printed circuit board.
7. The method of manufacturing the MEMS assembly of claim 6 wherein electrically coupling the MEMS subassembly to the printed circuit board includes:
wirebonding the MEMS subassembly to the printed circuit board.
8. The method of manufacturing the MEMS assembly of claim 7 wherein electrically coupling the MEMS subassembly to the printed circuit board further includes:
encapsulating the wirebonding in epoxy.
9. The method of manufacturing the MEMS assembly of claim 1 further comprising:
mounting a holder assembly to the MEMS subassembly.
10. The method of manufacturing the MEMS assembly of claim 9 wherein mounting the holder assembly to the MEMS subassembly includes:
applying epoxy to the printed circuit board;
positioning the holder assembly on the epoxy; and
curing the epoxy.
11. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:
mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes, applying epoxy to the metal plate, positioning the MEMS actuator on the epoxy, and curing the epoxy;
mounting an image sensor assembly to the MEMS actuator;
electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly;
mounting the MEMS subassembly to a printed circuit board; and
electrically coupling the MEMS subassembly to the printed circuit board.
12. The method of manufacturing the MEMS assembly of claim 11 wherein mounting the image sensor assembly to the MEMS actuator includes:
applying epoxy to the MEMS actuator;
positioning the image sensor on the epoxy; and
curing the epoxy.
13. The method of manufacturing the MEMS assembly of claim 11 wherein electrically coupling the image sensor assembly to the MEMS actuator includes:
wirebonding the image sensor assembly to the MEMS actuator.
14. The method of manufacturing the MEMS assembly of claim 11 wherein mounting the MEMS subassembly to the printed circuit board includes:
applying epoxy to the printed circuit board;
positioning the MEMS subassembly on the epoxy; and
curing the epoxy.
15. The method of manufacturing the MEMS assembly of claim 11 wherein electrically coupling the MEMS subassembly to the printed circuit board includes:
wirebonding the MEMS subassembly to the printed circuit board; and
encapsulating the wirebonding in epoxy.
16. The method of manufacturing the MEMS assembly of claim 11 further comprising:
mounting a holder assembly to the MEMS subassembly.
17. The method of manufacturing the MEMS assembly of claim 16 wherein mounting the holder assembly to the MEMS subassembly includes:
applying epoxy to the printed circuit board;
positioning the holder assembly on the epoxy; and
curing the epoxy.
18. A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly comprising:
mounting a MEMS actuator to a metal plate, wherein mounting the MEMS actuator to the metal plate includes, applying epoxy to the metal plate, positioning the MEMS actuator on the epoxy, and curing the epoxy;
mounting an image sensor assembly to the MEMS actuator;
electrically coupling the image sensor assembly to the MEMS actuator, thus forming a MEMS subassembly;
mounting the MEMS subassembly to a printed circuit board;
electrically coupling the MEMS subassembly to the printed circuit board; and
mounting a holder assembly to the MEMS subassembly.