Solid-state imaging device, method of manufacturing the same, and electronic equipment
A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
1. An imaging device, comprising:
a semiconductor substrate including:
a first groove portion provided between adjacent photoelectric conversion elements; and
a second groove portion provided adjacent to the first groove portion;
an hafnium oxide film disposed, at least in part, in the first groove portion and the second groove portion, wherein the hafnium oxide film extends from the first groove portion to the second groove portion along a light-incident side of the semiconductor substrate; and
a tantalum oxide film disposed at a light-incident side of at least a portion of the hafnium oxide film between the first groove portion and the second groove portion.
2. The imaging device according to claim 1 , further comprising:
a pixel separation portion disposed in the semiconductor substrate that includes a first pixel separation portion and a second pixel separation portion, wherein the first pixel separation portion includes the first groove portion and the second pixel separation portion includes the second groove portion.
3. The imaging device according to claim 2 , further comprising:
a light-shielding portion disposed corresponding to the pixel separation portion.
4. The imaging device according to claim 3 , wherein the light-shielding portion is surrounded by the hafnium oxide film and the tantalum oxide film.
5. The imaging device according to claim 3 , wherein a thickness of the light shielding-portion is 100-400 μm.
6. The imaging device according to claim 1 , further comprising:
a wiring layer disposed at an opposite side of the semiconductor substrate to the light-incident side.
7. The imaging device according to claim 6 , further comprising:
a second substrate bonded to the wiring layer.
8. The imaging device according to claim 1 , further comprising:
a planarization film disposed at the light-incident side of the semiconductor substrate.
9. The imaging device according to claim 8 , further comprising:
a color filter disposed over the planarization film including: a first color filter, a second color filter disposed adjacent to the first color filter, and a third color filter disposed adjacent to the second color filter.
10. The imaging device according to claim 9 , wherein the first groove portion
is disposed at a boundary of the first color filter and the second color filter, and the second groove portion is disposed at a boundary of the second color filter and the third color filter.
11. The imaging device according to claim 9 , further comprising:
a micro lens disposed over the color filter.
12. The imaging device according to claim 1 , wherein a thickness of the hafnium oxide film is thicker than a thickness of the tantalum oxide film.
13. The imaging device according to claim 1 , wherein a thickness of the hafnium oxide film is 1-20 nm.
14. The imaging device according to claim 1 , wherein a total thickness of the hafnium oxide film and the tantalum oxide film is 40-80 nm.
15. The imaging device according to claim 1 , wherein a thickness of the semiconductor substrate is 10-20 μm.
16. An imaging device, comprising:
a semiconductor substrate having a first side that receives light, and a second side opposite to the first side;
a photoelectric conversion region disposed in the semiconductor substrate;
a hafnium oxide film disposed above the first side of the semiconductor substrate;
a light-shielding portion comprising a first film including titanium and a second film including tungsten, the second film disposed above the first film;
a silicon oxide film disposed between the hafnium oxide film and the first film;
a third film including silicon and oxygen disposed above the light-shielding portion; and
a wiring layer disposed on the second side of the semiconductor substrate.
17. The imaging device according to claim 16 , further comprising:
a pixel transistor in the wiring layer.
18. The imaging device according to claim 16 , wherein the third film contacts the second film at a side of the second film opposite from the first film.
19. The imaging device according to claim 16 , further comprising:
a planarization film disposed at the first side of the semiconductor substrate; and
a color filter disposed over the planarization film including: a first color filter, a second color filter disposed adjacent to the first color filter, and a third color filter disposed adjacent to the second color filter.
20. The imaging device according to claim 16 , wherein the first film and the second film correspond to a groove in the semiconductor substrate that is adjacent to the photoelectric conversion region.