Semiconductor integrated circuit device
A semiconductor chip including an internal circuit, a plurality of electrode pads and a plurality of I/O cells. The plurality of electrode pads are arranged on a first line, a second line and a third line. Each of the plurality of electrode pads arranged at least on the first and second lines overlaps corresponding one of the plurality of I/O cells in a plan view. The plurality of I/O cells are provided on a peripheral region of the semiconductor chip. Each of the plurality of I/O cells includes a protective circuit, and is connected to corresponding one of the plurality of electrode pads. The protective circuit includes a power source-side protective circuit provided between the corresponding one of the plurality of electrode pads and a power source wiring; and a ground-side protective circuit provided between the corresponding one of the plurality of electrode pads and a ground wiring.
1. A semiconductor integrated circuit device, comprising:
a semiconductor chip including an internal circuit, a plurality of electrode pads and a plurality of I/O cells, wherein:
the plurality of electrode pads are arranged in a first row, a second row and a third row, the first row being disposed closer to an outermost edge of the semiconductor chip than the second row, and the second row being disposed closer to the outermost edge of the semiconductor chip than the third row,
each of the plurality of electrode pads arranged at least in the first and second rows overlaps corresponding one of the plurality of I/O cells in a plan view,
the plurality of I/O cells are provided on a peripheral region of the semiconductor chip,
each of the plurality of I/O cells includes a protective circuit,
each of the plurality of I/O cells is connected to corresponding one of the plurality of electrode pads,
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding one of the plurality of electrode pads and a power source wiring; and
a ground-side protective circuit provided between the corresponding one of the plurality of electrode pads and a ground wiring, and
the power source-side protective circuit is positioned closer to the outermost edge of the semiconductor chip than the ground-side protective circuit.
2. The semiconductor integrated circuit device of claim 1 , wherein
the plurality of electrode pads are arranged in a zigzag pattern between the first, second and third rows.
3. The semiconductor integrated circuit device of claim 1 , wherein
the power source wiring overlaps the power source-side protective circuit in a plan view, and the ground wiring overlaps the ground-side protective circuit in a plan view.
4. The semiconductor integrated circuit device of claim 1 , wherein
each of the power source-side protective circuit and the ground-side protective circuit includes a MOS transistor.
5. The semiconductor integrated circuit device of claim 1 , wherein
each of the power source-side protective circuit and the ground-side protective circuit includes a diode.
6. The semiconductor integrated circuit device of claim 1 , wherein
each of the plurality of I/O cells includes at least one of output transistors and an input circuit.
7. The semiconductor integrated circuit device of claim 1 , wherein
side edges of the plurality of electrode pads arranged in the first row, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed in a substantially same row as side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor chip.
8. A semiconductor integrated circuit device, comprising:
a semiconductor chip including an internal circuit, a plurality of electrode pads and a plurality of I/O cells, wherein:
the plurality of electrode pads are arranged in a first row, a second row and a third row, the first row being disposed closer to an outermost edge of the semiconductor chip than the second row, and the second row being disposed closer to the outermost edge of the semiconductor chip than the third row,
each of the plurality of electrode pads arranged at least in the first and second rows overlaps corresponding one of the plurality of I/O cells in a plan view,
the plurality of I/O cells are provided on a peripheral region of the semiconductor chip,
each of the plurality of I/O cells includes a protective circuit,
each of the plurality of I/O cells is connected to corresponding one of the plurality of electrode pads,
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding one of the plurality of electrode pads and a power source wiring; and
a ground-side protective circuit provided between the corresponding one of the plurality of electrode pads and a ground wiring, and
the ground-side protective circuit is positioned closer to the outermost edge of the semiconductor chip than the power source-side protective circuit.
9. The semiconductor integrated circuit device of claim 8 , wherein
the plurality of electrode pads are arranged in a zigzag pattern between the first, second and third rows.
10. The semiconductor integrated circuit device of claim 8 , wherein
the power source wiring overlaps the power source-side protective circuit in a plan view, and the ground wiring overlaps the ground-side protective circuit in a plan view.
11. The semiconductor integrated circuit device of claim 8 , wherein
each of the power source-side protective circuit and the ground-side protective circuit includes a MOS transistor.
12. The semiconductor integrated circuit device of claim 8 , wherein
each of the power source-side protective circuit and the ground-side protective circuit includes a diode.
13. The semiconductor integrated circuit device of claim 8 , wherein
each of the plurality of I/O cells includes at least one of output transistors and an input circuit.
14. The semiconductor integrated circuit device of claim 8 , wherein
side edges of the plurality of electrode pads arranged in the first row, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed in a substantially same row as side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor chip.
15. A semiconductor integrated circuit device, comprising:
a semiconductor chip including an internal circuit, a plurality of electrode pads and a plurality of I/O cells, wherein:
the plurality of electrode pads are arranged in a first row, a second row and a third row, the first row being disposed closer to an outermost edge of the semiconductor chip than the second row, and the second row being disposed closer to the outermost edge of the semiconductor chip than the third row,
each of the plurality of electrode pads arranged at least in the first and second rows overlaps corresponding one of the plurality of I/O cells in a plan view,
the plurality of I/O cells are provided on a peripheral region of the semiconductor chip,
each of the plurality of I/O cells includes a protective circuit,
each of the plurality of I/O cells is connected to corresponding one of the plurality of electrode pads, and
side edges of the plurality of electrode pads arranged in the first row, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed in a substantially same row as side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor chip.
16. The semiconductor integrated circuit device of claim 15 , wherein
the plurality of electrode pads are arranged in a zigzag pattern between the first, second and third rows.
17. The semiconductor integrated circuit device of claim 15 , wherein:
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding one of the plurality of electrode pads and a power source wiring; and
a ground-side protective circuit provided between the corresponding one of the plurality of electrode pads and a ground wiring, and
the power source wiring overlaps the power source-side protective circuit in a plan view, and the ground wiring overlaps the ground-side protective circuit in a plan view.
18. The semiconductor integrated circuit device of claim 15 , wherein:
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding one of the plurality of electrode pads and a power source wiring; and
a ground-side protective circuit provided between the corresponding one of the plurality of electrode pads and a ground wiring, and
each of the power source-side protective circuit and the ground-side protective circuit includes a MOS transistor.
19. The semiconductor integrated circuit device of claim 15 , wherein:
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding one of the plurality of electrode pads and a power source wiring; and
a ground-side protective circuit provided between the corresponding one of the plurality of electrode pads and a ground wiring, and
each of the power source-side protective circuit and the ground-side protective circuit includes a diode.
20. The semiconductor integrated circuit device of claim 15 , wherein
each of the plurality of I/O cells includes at least one of output transistors and an input circuit.