Method of detecting spot shape of pulsed laser beam
A method of detecting a spot shape of a pulsed laser beam, includes applying a pulsed laser beam having a wavelength absorbable by an inspection wafer held on a chuck table continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer. An image of the laser spots is captured, and profiles of shapes of the laser spots are extracted from the captured image of the laser spots. A degree of similarity between the captured image and the profile of an ideal laser spot shape is calculated and stored in a memory. The shapes of the laser spots are found to be improper if the calculated degree of similarity is lower than a threshold value.
1. A method of detecting a spot shape of a pulsed laser beam, the method comprising:
an inspection wafer placing step of placing an inspection wafer on a chuck table;
after performing the inspection wafer placing step, a laser spot forming step of applying a pulsed laser beam having a wavelength absorbable by the inspection wafer continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer with clearances between adjacent ones of the laser spots;
after performing the laser spot forming step, an imaging step of capturing an image of the laser spots with imaging means;
a calculating step of extracting profiles of shapes of the laser spots from the image of the laser spots captured in the imaging step, and calculating a degree of similarity of the extracted profiles to the profile of an ideal laser spot shape stored in storage means;
a properness diagnosing step of deciding that the shapes of the laser spots are improper if the degree of similarity calculated in the calculating step is lower than a threshold,
wherein the laser spot forming step is carried out after the elapsing of a predetermined period during which if impurities have settled on an optical system or a beam condenser through which the pulsed laser beam travels, a component of the optical system or the beam condenser is heated and expanded due to the impurities when the pulsed laser beam travels through the optical system and the beam condenser.
2. A method of detecting a spot shape of a pulsed laser beam, the method comprising:
an inspection wafer placing step of placing an inspection wafer on a chuck table;
after performing the inspection wafer placing step, a laser spot forming step of applying a pulsed laser beam having a wavelength absorbable by the inspection wafer continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer with clearances between adjacent ones of the laser spots;
after performing the laser spot forming step, an imaging step of capturing an image of the laser spots with imaging means;
a calculating step of extracting profiles of shapes of the laser spots from the image of the laser spots captured in the imaging step, and calculating a degree of similarity of the extracted profiles to the profile of an ideal laser spot shape stored in storage means;
a properness diagnosing step of deciding that the shapes of the laser spots are improper if the degree of similarity calculated in the calculating step is lower than a threshold value, wherein the threshold value is a value higher than a value between a degree of similarity at which the laser spots function properly as fracture initiators in a wafer to be processed and a degree of similarity at which the laser spots do not function properly as fracture initiators in the wafer to be processed; and
a reporting step of reporting that the shapes of the laser spots are improper if it is decided in the properness diagnosing step that the shapes of the laser spots are improper.