Silicon carbide epitaxial substrate and method of manufacturing silicon carbide semiconductor device
A silicon carbide epitaxial substrate has a silicon carbide single-crystal substrate and a silicon carbide layer. A first ratio of an absolute value of a difference between a dopant density in a first end region and a dopant density in a central region to an average value of the dopant density in the first end region and the dopant density in the central region is not more than 40%. A second ratio of an absolute value of a difference between a dopant density in a second end region and the dopant density in the central region to an average value of the dopant density in the second end region and the dopant density in the central region is not more than 40%.
1. A silicon carbide epitaxial substrate comprising:
a silicon carbide single-crystal substrate including a first main surface; and
a silicon carbide layer on the first main surface,
the silicon carbide layer including a second main surface and a fourth main surface, the second main surface being opposite to the fourth main surface in direct contact with the silicon carbide single-crystal substrate,
the second main surface having a maximum diameter of not less than 100 mm and not more than 300 mm,
the silicon carbide single-crystal substrate and the silicon carbide layer being provided with a linear orientation flat,
the silicon carbide layer having a central region, a first end region and a second end region,
the central region being located 2 μm away from a center of the second main surface toward the first main surface in a direction perpendicular to the second main surface,
the first end region being located 2 μm away from the second main surface toward the first main surface in a direction perpendicular to the second main surface, and being located 1 mm away from the orientation flat toward the central region,
the second end region being located 2 μm away from the second main surface toward the first main surface in a direction perpendicular to the second main surface and in a direction circumferentially rotated 90° counterclockwise from the first end region when viewed from above the second main surface so that the silicon carbide layer is on other side of the second main surface, and being located 1 mm away from an outer edge of the silicon carbide layer toward the central region,
the silicon carbide layer having a thickness of not less than 5 μm and not more than 15 μm,
a first ratio of an absolute value of a difference between a dopant density in the first end region and a dopant density in the central region to an average value of the dopant density in the first end region and the dopant density in the central region being more than 20% and not more than 40%,
a second ratio of an absolute value of a difference between a dopant density in the second end region and the dopant density in the central region to an average value of the dopant density in the second end region and the dopant density in the central region being more than 20% and not more than 40%.
2. The silicon carbide epitaxial substrate according to claim 1 , wherein
the first ratio is not more than 30%.
3. The silicon carbide epitaxial substrate according to claim 1 , wherein
the second ratio is not more than 30%.
4. The silicon carbide epitaxial substrate according to claim 1 , wherein
the maximum diameter is not less than 150 mm.
5. A method of manufacturing a silicon carbide semiconductor device, comprising:
preparing the silicon carbide epitaxial substrate according to claim 1 ; and
processing the silicon carbide epitaxial substrate.