Temperature adjustment apparatus
Provided is a highly reliable temperature adjustment apparatus which uses a temperature adjustment element and quantitatively evaluates the temperature adjustment performance of the temperature adjustment element. The temperature adjustment apparatus is provided with: a temperature adjustment element; one or more temperature detection elements provided near the temperature adjustment element; a calculation unit for calculating the output of the temperature detection element; and a display unit for displaying at least one of a time calculated by the calculation unit as a time at which the temperature adjustment performance of the temperature adjustment is predicted to be below a desired level, the number of operations and the time of current conduction or a warning based on the result of calculation.
1. A temperature adjustment apparatus comprising:
a temperature adjustment element disposed adjacent to a temperature adjustment block and which raises and lowers a temperature of the temperature adjustment block based on a conduction current input received by said temperature adjustment element;
at least one temperature detection element provided near the temperature adjustment element; and
a display,
wherein the temperature adjustment element comprises a number, Np, of pairs of semiconductor elements,
wherein the temperature adjustment apparatus is configured to evaluate a change of temperature adjustment performance of the temperature adjustment element using change amounts of temperature characteristic coefficients of an electrical resistance, r, of the temperature adjustment element that are not dependent on temperature, said temperature adjustment apparatus being configured to determine said electrical resistance, r, based on said number Np of pairs of semiconductor elements of said temperature adjustment element, and
wherein the display is configured to output at least one of a time at which the temperature adjustment performance of the temperature adjustment element is predicted to be below a desired temperature adjustment performance, a number of operations and a time of current conduction of the temperature adjustment element, or a warning.
2. The temperature adjustment apparatus according to claim 1 , wherein the electrical resistance, r, is further determined based on a cross-sectional area of a semiconductor element A, a height of a semiconductor element h, temperature T, a zeroth-order temperature characteristic coefficient ρ 0 , a first-order temperature characteristic coefficient ρ 1 , and a second-order temperature characteristic coefficient by, according to
r
=
2
N
p
h
A
[
ρ
0
+
ρ
1
T
+
ρ
2
T
2
]
.
3. The temperature adjustment apparatus according to claim 2 , wherein at least one value of ρ 0 , ρ 1 , and ρ 2 is a calculated value.
4. The temperature adjustment apparatus according to claim 3 , wherein each of the values of ρ 0 , ρ 1 , and ρ 2 are calculated using a data assimilation technique.
5. The temperature adjustment apparatus according to claim 1 , wherein the evaluation of the change of the temperature adjustment performance is determined by data assimilation in which simulation and a measurement result are compared with each other, and parameters regarding the simulation are corrected.
6. The temperature adjustment apparatus according to claim 1 , wherein the number of operations is a number of tests or analyses which are conducted until a time at which the temperature adjustment performance of the temperature adjustment element becomes below the desired temperature adjustment performance.