IP Library › Granted Patent US 10,685,983
Granted Patent B2
US 10,685,983 · App. 15/794,464 · Granted Jun 16, 2020

Transistor, semiconductor device, and electronic device

Inventors: Daigo Ito (Isehara, JP); Yutaka Okazaki (Isehara, JP); Takahisa Ishiyama (Atsugi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/1207H01L27/115H01L27/1225H01L27/1251H01L27/1255H01L29/7869H01L27/11556H01L29/78648
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Quick Facts
Patent No.
US 10,685,983
App. No.
15/794,464
Granted
Jun 16, 2020
Kind
B2
Abstract

To provide a semiconductor device capable of retaining data for a long time. The semiconductor device includes a first transistor, an insulator covering the first transistor, and a second transistor over the insulator. The first transistor includes a first gate electrode, a second gate electrode overlapping with the first gate electrode, and a semiconductor between the first gate electrode and the second gate electrode. The first gate electrode is electrically connected to one of a source and a drain of the second transistor.

Claims (59)

1. A semiconductor device comprising:

a first transistor;

an insulator covering the first transistor; and

a second transistor over the insulator,

wherein the first transistor includes:

a first gate electrode;

a second gate electrode overlapping with the first gate electrode; and

a semiconductor between the first gate electrode and the second gate electrode,

wherein the first gate electrode is electrically connected to one of a source and a drain of the second transistor and a third gate electrode of the second transistor,

wherein on-state current of the first transistor is larger than on-state current of the second transistor, and

wherein a drain current of the second transistor when a gate voltage applied to the second transistor is 0 V is smaller than a drain current of the first transistor when a gate voltage applied to the first transistor is 0 V.

2. The semiconductor device according to claim 1 ,

wherein the semiconductor is a first semiconductor,

wherein the second transistor includes:

a second semiconductor; and

a first electrode and a second electrode electrically connected to the second semiconductor, and

wherein the first gate electrode and the one of the source and the drain of the second transistor are electrically connected to each other through one of the first electrode and the second electrode.

3. The semiconductor device according to claim 1 ,

wherein the semiconductor is located over the first gate electrode, and

wherein the second gate electrode is located over the semiconductor.

4. The semiconductor device according to claim 1 ,

wherein the second transistor includes a second semiconductor below the third gate electrode.

5. The semiconductor device according to claim 1 ,

wherein carrier mobility of the first transistor is higher than carrier mobility of the second transistor.

6. A semiconductor device comprising:

a first transistor;

an insulator covering the first transistor; and

a second transistor and a capacitor over the insulator,

wherein the first transistor includes:

a first gate electrode;

a second gate electrode overlapping with the first gate electrode; and

a semiconductor between the first gate electrode and the second gate electrode,

wherein the first gate electrode is electrically connected to one of a source and a drain of the second transistor and a third gate electrode of the second transistor,

wherein on-state current of the first transistor is larger than on-state current of the second transistor, and

wherein a drain current of the second transistor when a gate voltage applied to the second transistor is 0 V is smaller than a drain current of the first transistor when a gate voltage applied to the first transistor is 0 V.

7. The semiconductor device according to claim 6 ,

wherein the semiconductor is a first semiconductor,

wherein the second transistor includes:

a second semiconductor; and

a first electrode and a second electrode electrically connected to the second semiconductor, and

wherein the first gate electrode and the one of the source and the drain of the second transistor are electrically connected to each other through one of the first electrode and the second electrode.

8. The semiconductor device according to claim 6 ,

wherein the semiconductor is located over the first gate electrode, and

wherein the second gate electrode is located over the semiconductor.

9. The semiconductor device according to claim 6 ,

wherein the second transistor includes a second semiconductor below the third gate electrode.

10. The semiconductor device according to claim 6 ,

wherein carrier mobility of the first transistor is higher than carrier mobility of the second transistor.

11. The semiconductor device according to claim 6 ,

wherein the capacitor includes:

a third electrode;

a second insulator over the third electrode; and

a fourth electrode over the second insulator, and

wherein the third electrode is electrically connected to one of a source and a drain of the first transistor.

12. The semiconductor device according to claim 6 ,

wherein the capacitor includes:

a third electrode formed with a same material as a source electrode and a drain electrode of the second transistor;

a second insulator over the third electrode, the second insulator formed with a same material as a gate insulating film of the second transistor; and

a fourth electrode over the second insulator, the fourth electrode formed with a same material as the third gate electrode.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2017
From: ITO, DAIGO; OKAZAKI, YUTAKA; ISHIYAMA, TAKAHISA
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 043959/0698 →
Priority Claims (1)
JP 2016-220496 · Nov 11, 2016 · national
Continuity (1)
Related Publication 20180138208A1 · May 17, 2018
Cited By (1)
US 12,635,144