Semiconductor device and method for fabricating the same
A semiconductor device comprises a semiconductor substrate and a semiconductor fin. The semiconductor substrate has an upper surface and a recess extending downwards into the semiconductor substrate from the upper surface. The semiconductor fin is disposed in the recess and extends upwards beyond the upper surface, wherein the semiconductor fin is directly in contact with semiconductor substrate, so as to form at least one semiconductor hetero-interface on a sidewall of the recess.
1. A method for fabricating a semiconductor device, comprising:
providing a semiconductor substrate having an upper surface and a recess extending downwards into the semiconductor substrate from the upper surface; and
forming a semiconductor fin in the recess and extending upwards beyond the upper surface, wherein the semiconductor fin comprises a first material other than a material used to constitute the semiconductor substrate; the first material has a germanium (Ge) concentration gradually decreased varied from a bottom surface of the recess to the upper surface; and the semiconductor fin is directly in contact with semiconductor substrate, so as to form at least one semiconductor hetero-interface on a sidewall of the recess.
2. The method according to claim 1 , further comprises:
forming a sacrificing fin protruding from the upper surface of the semiconductor substrate;
forming a dielectric layer on the sacrificing fin;
performing a planarization process using the sacrificing fin as a stop layer; and
removing the sacrificing fin to form the trench and removing a portion of the semiconductor substrate exposed from the trench to form the recess.
3. The method according to claim 1 , wherein the process for forming the semiconductor fin comprises steps of depositing the first semiconductor material other than the material used to constitute the semiconductor substrate in the recess and the trench, so as to form the semiconductor hetero-interface with dislocation between two levels respectively parallel to a bottom of the recess surface and the upper surface.
4. The method according to claim 3 , further comprising steps of depositing a second semiconductor material on the first semiconductor material to fill the recess and the trench.
5. The method according to claim 3 , wherein the semiconductor substrate comprises silicon.
6. The method according to claim 2 , wherein the process for removing the sacrificing fin comprises steps of performing a dry etching on the sacrificing fin.
7. The method according to claim 2 , wherein the process for forming the recess comprises steps of performing an isotropic etching.
8. The method according to claim 2 , wherein the trench and the recess are formed by an identical etching process.
9. The method according to claim 2 , wherein the recess has a depth substantially ranging from 20 nm to 80 nm, and the semiconductor fin has an aspect ratio substantially ranging from 10 to 20.