Printed circuit board and a method for producing a printed circuit board

1. A printed circuit board for an electronic component, the printed circuit board comprising:

an unpopulated circuit board;

an electrically insulating substrate;

a foil comprising an anti-adhesion coating, the foil arranged within the electrically insulating substrate;

a number of electrically conductive conductor tracks; and

at least one sensor dome having:

a sensor head arranged within the electrically insulating substrate, wherein the sensor head is arranged above the foil in relation to a vertical axis relative to a surface side of the electrically insulating substrate; and

a carrier body supporting the sensor head, the carrier body formed integrally with the electrically insulating substrate, the carrier body is cut out with a predefined contour encompassing a section surrounding the sensor head from the electrically insulating substrate, at least a part of the carrier body remains integrally connected to the electrically insulating substrate,

wherein the cut-out carrier body with the sensor head is positioned in a direction of the vertical axis,

wherein the sensor dome is positioned such that the cut-out carrier body with the sensor head is moved in the direction of the vertical axis relative to the surface side; and

a cover encapsulating the sensor dome.

2. The printed circuit board of claim 1 , wherein the electrically insulating substrate is formed from a fiber-reinforced plastic.

3. The printed circuit board of claim 1 , wherein the carrier body projects perpendicularly from a surface side of the electrically insulating substrate.

4. The printed circuit board of claim 1 , wherein the sensor head is connected mechanically and in electrically conductive fashion to at least one conductor track.

5. A method for producing a printed circuit board having an electrically insulating substrate, a number of electrically conductive conductor tracks, and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head, wherein the carrier body is formed integrally with the substrate, the method comprising:

integrally forming the carrier body of the sensor dome with the substrate of the printed circuit board by:

providing an unpopulated circuit board;

arranging a foil with an anti-adhesion coating within the electrically insulating substrate;

arranging the sensor head within the electrically insulating substrate, wherein the sensor head is arranged above the foil in relation to a vertical axis relative to a surface side of the electrically insulating substrate;

cutting out the carrier body with a predefined contour, which encompasses a section surrounding the sensor head;

positioning the sensor dome, wherein the cut-out carrier body with the sensor head is moved in a direction of the vertical axis relative to the surface side; and

encapsulating the sensor dome with a cover,

wherein the carrier body is cut out, with the predefined contour, from the electrically insulating substrate, wherein at least a part of the carrier body remains integrally connected to the electrically insulating substrate, and

wherein the cut-out carrier body is positioned with the sensor head in the direction of the vertical axis.

6. The method of claim 5 , wherein a penetration depth of a cutting tool for cutting out the carrier body is set in a manner dependent on a situation of the foil in the electrically insulating substrate.